EPO-TEK® H20S

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Epoxy Technology Inc.
Trademark: EPO-TEK®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: NhPDX6_EPO-TEK-H20S.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
Wechat: WECHAT
Message
EPO-TEK® H20S is a modified version of EPO-TEK® H20E, designed primarily for die stamping and dispensing techniques for chip bonding. EPO-TEK® H20S is a highly reliable, two component, silver-filled epoxy with a smooth, thixotropic consistency. In addition to the high electrical conductivity, the short curing cycles, the proven reliability, and the convenient mix ratio, EPO-TEK® H20S is extremely simple to use.
General Information
Filler / Reinforcement
  • Silver
Features
  • Electrically Conductive
  • Electromagnetic Shielding (EMI)
  • Fast Cure
  • Radio Frequency Shielding (RFI)
  • Thixotropic
Uses
  • Adhesives
  • Bonding
  • Electrical/Electronic Applications
  • LCD Applications
  • LEDs
Agency Ratings
  • EC 1907/2006 (REACH)
  • EU 2003/11/EC
  • EU 2006/122/EC
RoHS Compliance
  • RoHS Compliant
Forms
  • Paste
PhysicalNominal ValueUnit
Ion Type
    Cl- 162ppm
    K+ 4ppm
    Na+ 0ppm
    NH4+ 282ppm
Particle Size < 20.0µm
Additional InformationNominal ValueUnitTest Method
Degradation Temperature 414°CTGA
Die Shear Strength - >5 kg (23°C) 11.7MPa
Operating Temperature
    Continuous -55 to 200°C
    Intermittent -55 to 300°C
Storage Modulus (23°C) 2.34GPa
Thixotropic Index 5.00
Weight Loss on Heating
    200°C 0.40%
    250°C 0.60%
    300°C 1.4%
ThermalNominal ValueUnit
Glass Transition Temperature 1> 80.0°C
CLTE - Flow
    -- 23.1E-5cm/cm/°C
    -- 31.2E-4cm/cm/°C
Thermal Conductivity 3.3W/m/K
ThermosetNominal ValueUnitTest Method
Thermoset Components
    Part A Mix Ratio by Weight: 1.0
    Part B Mix Ratio by Weight: 1.0
Shelf Life (23°C)52wk
Uncured PropertiesNominal ValueUnitTest Method
Color
    -- 4Silver
    -- 5Silver
Density
    Part A 1.74g/cm³
    Part B 3.06g/cm³
Viscosity 6(23°C)1.8 to 2.8Pa·s
Curing Time (150°C)1.0hr
Pot Life 4300min
Cured PropertiesNominal ValueUnitTest Method
Shore Hardness (Shore D)64
Lap Shear Strength (23°C)8.55MPa
Volume Resistivity (23°C)< 5.0E-4ohms·cm
Note Message
1 .Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min
2 .Below Tg
3 .Above Tg
4 .Part B
5 .Part A
6 .100 rpm
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