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EPO-TEK® H20S
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | NhPDX6_EPO-TEK-H20S.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| Message |
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| EPO-TEK® H20S is a modified version of EPO-TEK® H20E, designed primarily for die stamping and dispensing techniques for chip bonding. EPO-TEK® H20S is a highly reliable, two component, silver-filled epoxy with a smooth, thixotropic consistency. In addition to the high electrical conductivity, the short curing cycles, the proven reliability, and the convenient mix ratio, EPO-TEK® H20S is extremely simple to use. |
| General Information | |
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| Filler / Reinforcement |
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| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Ion Type | |||
| Cl- | 162 | ppm | |
| K+ | 4 | ppm | |
| Na+ | 0 | ppm | |
| NH4+ | 282 | ppm | |
| Particle Size | < 20.0 | µm |
| Additional Information | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Degradation Temperature | 414 | °C | TGA |
| Die Shear Strength - >5 kg (23°C) | 11.7 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 200 | °C | |
| Intermittent | -55 to 300 | °C | |
| Storage Modulus (23°C) | 2.34 | GPa | |
| Thixotropic Index | 5.00 | ||
| Weight Loss on Heating | |||
| 200°C | 0.40 | % | |
| 250°C | 0.60 | % | |
| 300°C | 1.4 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 80.0 | °C | |
| CLTE - Flow | |||
| -- 2 | 3.1E-5 | cm/cm/°C | |
| -- 3 | 1.2E-4 | cm/cm/°C | |
| Thermal Conductivity | 3.3 | W/m/K |
| Thermoset | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Thermoset Components | |||
| Part A | Mix Ratio by Weight: 1.0 | ||
| Part B | Mix Ratio by Weight: 1.0 | ||
| Shelf Life (23°C) | 52 | wk |
| Uncured Properties | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Color | |||
| -- 4 | Silver | ||
| -- 5 | Silver | ||
| Density | |||
| Part A | 1.74 | g/cm³ | |
| Part B | 3.06 | g/cm³ | |
| Viscosity 6(23°C) | 1.8 to 2.8 | Pa·s | |
| Curing Time (150°C) | 1.0 | hr | |
| Pot Life | 4300 | min |
| Cured Properties | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Shore Hardness (Shore D) | 64 | ||
| Lap Shear Strength (23°C) | 8.55 | MPa | |
| Volume Resistivity (23°C) | < 5.0E-4 | ohms·cm |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | Part B |
| 5 . | Part A |
| 6 . | 100 rpm |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| PRL AH-GP1 | Polymer Resources Ltd. | Acetal (POM) Homopolymer | PRL |
| Styropor® F 395 E | BASF Corporation | PS (EPS) | Styropor® |
| TRIEL® 5652EM | Samyang Corporation | TPEE | TRIEL® |
| Fibremod™ WE380HP | Borealis AG | PP, Unspecified | Fibremod™ |
| Polimid A 20 FC | Poliblend S.p.a. | Nylon 66 | Polimid A |
