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EPO-TEK® H20E-LV
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | NaKAtu_EPO-TEK-H20E-LV.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| Message |
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| EPO-TEK® H20E-LV is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a low viscosity version of EPO-TEK® H20E, semiconductor die-attach epoxy. |
| General Information | |
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| Filler / Reinforcement |
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| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Ion Type | |||
| Cl- | 102 | ppm | |
| K+ | 25 | ppm | |
| Na+ | 98 | ppm | |
| NH4+ | 320 | ppm | |
| Particle Size | < 45.0 | µm |
| Additional Information | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Degradation Temperature | 400 | °C | TGA |
| Die Shear Strength - >5 kg (23°C) | 11.7 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 200 | °C | |
| Intermittent | -55 to 300 | °C | |
| Storage Modulus (23°C) | 4.42 | GPa | |
| Thixotropic Index | 3.43 | ||
| Weight Loss on Heating (300°C) | 2.3 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 80.0 | °C | |
| CLTE - Flow | |||
| -- 2 | 2.6E-5 | cm/cm/°C | |
| -- 3 | 9.3E-5 | cm/cm/°C | |
| Thermal Conductivity | 2.5 | W/m/K |
| Thermoset | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Thermoset Components | |||
| Part A | Mix Ratio by Weight: 1.0 | ||
| Part B | Mix Ratio by Weight: 1.0 | ||
| Shelf Life (23°C) | 52 | wk |
| Uncured Properties | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Color | |||
| -- 4 | Silver | ||
| -- 5 | Silver | ||
| Density | |||
| Part A | 1.93 | g/cm³ | |
| Part B | 3.06 | g/cm³ | |
| Viscosity 6(23°C) | 1.8 to 2.8 | Pa·s | |
| Curing Time (150°C) | 1.0 | hr | |
| Pot Life | 4300 | min |
| Cured Properties | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Shore Hardness (Shore D) | 86 | ||
| Lap Shear Strength (23°C) | 10.3 | MPa | |
| Volume Resistivity (23°C) | < 4.0E-4 | ohms·cm |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | Part B |
| 5 . | Part A |
| 6 . | 100 rpm |
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|---|---|---|---|
| Radilon® S USX200 100 NAT | Radici Plastics | Nylon 6 | Radilon® |
| NILAMID® A3 W GF55 | Nilit Plastics | Nylon 66 | NILAMID® |
| Geon™ 170 Series 4195 | Mexichem Specialty Resins, Inc. | PVC Homopolymer | Geon™ 170 Series |
| EnCom PC-PBT 1013 IM | EnCom, Inc. | PC+PBT | EnCom |
| Hostacom TRC 767N/1 | LyondellBasell Industries | TPO (POE) | Hostacom |
