Vyncolit® 2008

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Vyncolit N.V.
Trademark: Vyncolit®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: NY23AB_Vyncolit-2008.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
Wechat: WECHAT
Message
Vyncolit 2008 is a kind of epoxy. Epoxy resin material contains glass fiber reinforced material. This product is available in North America, Africa and the Middle East, Latin America, Europe or Asia Pacific. The processing methods are: resin transfer molding, compression molding or injection molding.

The main features of the Vyncolit 2008 are:
  • chemical resistance
  • low viscosity
  • Heat resistance

Typical application areas include:
  • Electrical/electronic applications
  • food contact applications
  • military applications
General Information
Filler / Reinforcement
  • Glass fiber reinforced material
Features
  • The degassing effect is low to no
  • Low viscosity
  • Solvent resistance
  • Anti-salt water/fog
  • Good thermal shock resistance
  • Good chemical resistance
  • alkali resistance
  • acid resistance
  • Non-corrosive
Uses
  • Electrical components
  • Military application
  • Connector
Agency Ratings
  • FDA not rated
  • USDA Unspecified Approval
Forms
  • Particles
Processing Method
  • Resin transfer molding
  • Compression molding
  • Injection molding
PhysicalNominal ValueUnitTest Method
Specific Gravity 1.85g/cm³ASTM D792
Bulk Factor 2.5ASTM D1895
Molding Shrinkage - Flow (Compression Molded)0.30 - 0.50%ASTM D955
HardnessNominal ValueUnitTest Method
Barcol Hardness 72ASTM D2583
MechanicalNominal ValueUnitTest Method
Tensile Strength 62.1MPaASTM D638
Flexural Modulus 15200MPaASTM D790
Flexural Strength 124MPaASTM D790
Compressive Strength 207MPaASTM D695
ImpactNominal ValueUnitTest Method
Notched Izod Impact 35J/mASTM D256A
ThermalNominal ValueUnitTest Method
Deflection Temperature Under Load (1.8 MPa, Unannealed)260°CASTM D648
CLTE - Flow 3.7E-5cm/cm/°CASTM D696
Thermal Conductivity 0.69W/m/KASTM C177
ElectricalNominal ValueUnitTest Method
Dielectric Strength 112kV/mmASTM D149
Dielectric Constant (1 MHz)4.00ASTM D150
Dissipation Factor (1 MHz)0.019ASTM D150
Arc Resistance 180secASTM D495
FlammabilityNominal ValueUnitTest Method
Oxygen Index 50%ASTM D2863
InjectionNominal ValueUnit
Middle Temperature 60.0 - 82.2°C
Nozzle Temperature 82.2 - 93.3°C
Processing (Melt) Temp 93.3 - 116°C
Mold Temperature 149 - 177°C
Injection Pressure 34.5 - 68.9MPa
Holding Pressure 13.8 - 34.5MPa
Back Pressure 0.345MPa
Injection instructions
Gauge: 0.3The value listed as Thermal Conductivity, ASTM C177, was tested in accordance with ASTM F433.Water Absorption, ASTM D570, 48 hrs, 50°C: 0.2%Dielectric Strength, ASTM D149, 60 Hz, Method B, wet: 310 V/milDielectric Constant, ASTM D150, 1000000 Hz, wet: 4Dissipation Factor, ASTM D150, 1000000 Hz, wet: 0.019Bulk Factor, ASTM D1895: 2 to 3Compression and Transfer Molding Conditions: Preheat Temperature: 180 to 225 °F Mold Temperature: 325 to 370 °F Compression Mold Pressure: 1000 to 5000 psi Transfer Mold Pressure: 1500 to 8000 psi Cure Time, 0.125 in: 60 to 90 sec
Note Message
1 .Method B (step by step)
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