Category: | PC , Polycarbonate |
Manufacturer: | NEXT Specialty Resins, Inc. |
Trademark: | NEXT SIGNATURE |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | NRYTFh_NEXT-SIGNATURE-PC-EG-100.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
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NEXT SIGNATURE PC EG-100 is a Polycarbonate (PC) material. It is available in North America. Primary attribute of NEXT SIGNATURE PC EG-100: Halogen Free. Typical applications include:
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Physical | Nominal Value | Unit | Test Method |
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Specific Gravity | 1.20 | g/cm³ | ASTM D792 |
Melt Mass-Flow Rate (MFR) | 3.0 | g/10 min | ASTM D1238 |
Hardness | Nominal Value | Unit | Test Method |
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Rockwell Hardness (M-Scale) | 70 | ASTM D785 |
Mechanical | Nominal Value | Unit | Test Method |
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Tensile Strength | 59.3 | MPa | ASTM D638 |
Tensile Elongation (Break) | 80 | % | ASTM D638 |
Flexural Modulus | 2070 | MPa | ASTM D790 |
Thermal | Nominal Value | Unit | Test Method |
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Deflection Temperature Under Load (1.8 MPa, Unannealed) | 131 | °C | ASTM D648 |
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