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EPO-TEK® H61
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | N35OIU_EPO-TEK-H61.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| Message |
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| EPO-TEK® H61 is a single component, thermally conductive, electrically insulating, epoxy adhesive for semiconductor, hybrid IC, and electronic circuit assembly applications. |
| General Information | |
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| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Ion Type | |||
| Cl- | 41 | ppm | |
| K+ | 0 | ppm | |
| Na+ | 140 | ppm | |
| NH4+ | 354 | ppm | |
| Particle Size | < 50.0 | µm |
| Additional Information | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Degradation Temperature | 425 | °C | TGA |
| Die Shear Strength - >20 kg (23°C) | 46.9 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 200 | °C | |
| Intermittent | -55 to 300 | °C | |
| Storage Modulus (23°C) | 5.46 | GPa | |
| Thixotropic Index | 1.32 | ||
| Weight Loss on Heating (200°C) | 0.080 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 110 | °C | |
| CLTE - Flow | |||
| -- 2 | 1.7E-5 | cm/cm/°C | |
| -- 3 | 9.5E-5 | cm/cm/°C | |
| Thermal Conductivity | 0.70 | W/m/K |
| Thermoset | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Shelf Life 4 | 26 | wk |
| Uncured Properties | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Color | White | ||
| Density | 2.39 | g/cm³ | |
| Viscosity 5(23°C) | 40 to 60 | Pa·s | |
| Curing Time (150°C) | 1.0 | hr | |
| Pot Life | 36000 | min |
| Cured Properties | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Shore Hardness (Shore D) | 89 | ||
| Lap Shear Strength (23°C) | 7.89 | MPa | |
| Relative Permittivity (1 kHz) | 4.75 | ||
| Volume Resistivity (23°C) | < 2.0E+13 | ohms·cm | |
| Dissipation Factor (1 kHz) | 6.0E-3 |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | Refrigerated |
| 5 . | 5 rpm |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| RTP 102CC HI FR | RTP Company | PP Copolymer | RTP |
| TECHLEN CM513TC | DAEHA Co., LTD | PP, Unspecified | TECHLEN |
| TEREZ ABS 5007 | TER HELL PLASTIC GMBH | ABS | TEREZ ABS |
| ADMER™ NF588A | Mitsui Chemicals America, Inc. | PE, Unspecified | ADMER™ |
| Hostacom EKC 425N G71412 | LyondellBasell Industries | PP, Unspecified | Hostacom |
