Order Products : sales@su-jiao.com
EPO-TEK® H77T
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | Mr5FSb_EPO-TEK-H77T.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
Wechat:
| Message |
|---|
| EPO-TEK® H77T is a two component, thermally conductive, electrically insulating epoxy designed for lid-sealing of hybrids found in hermetic packaging of micro-electronics. Lids can be ceramic, glass, aluminum or kovar. Package types can be plastic, metal cases or ceramic. |
| General Information | |
|---|---|
| Features |
|
| Uses |
|
| Agency Ratings |
|
| RoHS Compliance |
|
| Forms |
|
| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Particle Size | < 50.0 | µm |
| Additional Information | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Degradation Temperature | 413 | °C | TGA |
| Die Shear Strength - >5 kg (23°C) | 11.7 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 260 | °C | |
| Intermittent | -55 to 360 | °C | |
| Storage Modulus (23°C) | 5.40 | GPa | |
| Thixotropic Index | 3.00 | ||
| Weight Loss on Heating | |||
| 200°C | < 0.050 | % | |
| 250°C | 0.080 | % | |
| 300°C | 0.22 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 80.0 | °C | |
| CLTE - Flow | |||
| -- 2 | 3.4E-5 | cm/cm/°C | |
| -- 3 | 1.3E-4 | cm/cm/°C | |
| Thermal Conductivity | 1.1 | W/m/K |
| Thermoset | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Thermoset Components | |||
| Part A | Mix Ratio by Weight: 100 | ||
| Part B | Mix Ratio by Weight: 15 | ||
| Shelf Life (23°C) | 52 | wk |
| Uncured Properties | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Color | |||
| -- 4 | Amber | ||
| -- 5 | Grey | ||
| Density | |||
| Part B | 1.22 | g/cm³ | |
| Part A | 2.68 | g/cm³ | |
| Viscosity 6(23°C) | 23 to 34 | Pa·s | |
| Curing Time (150°C) | 1.0 | hr | |
| Pot Life | 480 | min |
| Cured Properties | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Shore Hardness (Shore D) | 89 | ||
| Lap Shear Strength (23°C) | 8.38 | MPa | |
| Relative Permittivity (1 kHz) | 5.40 | ||
| Volume Resistivity (23°C) | > 2.0E+13 | ohms·cm | |
| Dissipation Factor (1 kHz) | 4.0E-3 |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | Part B |
| 5 . | Part A |
| 6 . | 10 rpm |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| Shinko-Lac® ABS HF-3 | Mitsubishi Rayon America Inc. | ABS | Shinko-Lac® |
| COPYLENE® CM090L | Phillips 66 | PP Impact Copolymer | COPYLENE® |
| Gallonprene® GP520-4005 | Shenzhen Sungallon Rubber & Plastic Corporation Limited | TPE | Gallonprene® |
| Pinnacle PP 8238H | Pinnacle Polymers | PP Impact Copolymer | Pinnacle PP |
| Hostacom EKC 330N E1 G62514 | LyondellBasell Industries | PP Copolymer | Hostacom |
