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LNP™ THERMOCOMP™ EC008 compound
| Category: | PEI , Polyether Imide |
| Manufacturer: | SABIC Innovative Plastics Europe |
| Trademark: | LNP™ THERMOCOMP™ |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | LvmMSD_LNP-THERMOCOMP-EC008-compound.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| Message |
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LNP THERMOCOMP EC008 is a compound based on Polyetherimide resin containing Carbon Fiber. Added features include: Electrically Conductive. Also known as: LNP* THERMOCOMP* Compound EC-1008 Product reorder name: EC008 |
| General Information | |
|---|---|
| Filler / Reinforcement |
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| Features |
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| RoHS Compliance |
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| Processing Method |
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| Physical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Density | 1.44 | g/cm³ | ISO 1183 |
| Molding Shrinkage | ASTM D955 | ||
| Flow : 24 hr | 0.010 to 0.050 | % | |
| Across Flow : 24 hr | 0.10 to 0.50 | % |
| Mechanical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Tensile Modulus | 27000 | MPa | ISO 527-2/1 |
| Tensile Stress (Yield) | 211 | MPa | ISO 527-2/5 |
| Tensile Strain (Break) | 0.90 | % | ISO 527-2/5 |
| Flexural Modulus 1 | 22200 | MPa | ISO 178 |
| Flexural Stress | 286 | MPa | ISO 178 |
| Impact | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Notched Izod Impact Strength 2(23°C) | 8.0 | kJ/m² | ISO 180/1A |
| Unnotched Izod Impact Strength 3(23°C) | 25 | kJ/m² | ISO 180/1U |
| Thermal | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Heat Deflection Temperature 4(1.8 MPa, Unannealed, 64.0 mm Span) | 214 | °C | ISO 75-2/Af |
| Electrical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Surface Resistivity | 10 to 1.0E+3 | ohms | ASTM D257 |
| Injection | Nominal Value | Unit | |
|---|---|---|---|
| Drying Temperature | 121 to 149 | °C | |
| Drying Time | 4.0 to 6.0 | hr | |
| Suggested Max Moisture | 0.020 | % | |
| Rear Temperature | 343 to 354 | °C | |
| Middle Temperature | 354 to 366 | °C | |
| Front Temperature | 366 to 377 | °C | |
| Processing (Melt) Temp | 360 to 366 | °C | |
| Mold Temperature | 121 to 149 | °C | |
| Back Pressure | 0.344 to 0.689 | MPa | |
| Screw Speed | 60 to 100 | rpm |
| Note Message | |
|---|---|
| 1 . | 2.0 mm/min |
| 2 . | 80*10*4 |
| 3 . | 80*10*4 |
| 4 . | 80*10*4 mm |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| Aegis® H100QP | Honeywell | Nylon 6 | Aegis® |
| Arnite® TZ4 254 S | DSM Engineering Plastics | PBT | Arnite® |
| LNP™ THERMOCOMP™ EC006APQ compound | SABIC Innovative Plastics | PEI | LNP™ THERMOCOMP™ |
| OP - PC - Filled 30CF | Oxford Polymers | PC | OP - PC - Filled |
| Osterlene® PPH-2.6-BOPP | Osterman & Company | PP Homopolymer | Osterlene® |
