Promyde® B30 P MI

Category: Nylon 6 , Polyamide 6
Manufacturer: NUREL, S.A.
Trademark: Promyde®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: LbGcZH_Promyde-B30-P-MI.pdf
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Promyde B30 P MI is a Polyamide 6 impact modified, heat stabilised with equilibrated mechanical properties and optimal flow behaviour.

CHARACTERISTICS
Promyde B30 P MI is a polyamide 6 impact modified and heat stabilized giving NO BREAK in typical atmospheric conditions (see Charpy notched).

APPLICATIONS
Promyde B30 P MI allows a fast and efficient mould filling, and an easy mould release, that combined with its excellent mechanical and impact resistant properties, make it suitable for components requiring resistance to breakage by impact in the field of application, during assembly, and in the over moulding of components.
General Information
Additive
  • Impact modifier
  • heat stabilizer
Features
  • Impact modification
  • Impact resistance, good
  • Fast molding cycle
  • Good liquidity
  • Thermal Stability
  • Good demoulding performance
Processing Method
  • Injection molding
PhysicalDryConditionedUnitTest Method
Density (23°C)1.13--g/cm³ISO 1183
Melt Volume-Flow Rate (MVR) (275°C/5.0 kg)80.0--cm³/10minISO 1133
Molding Shrinkage
     Vertical flow direction 0.80 - 1.1--%
     Flow direction 0.90 - 1.1--%
Water Absorption ISO 62
     Saturated, 23°C 9.5--%ISO 62
     Equilibrium, 23°C, 50% RH 3.3--%ISO 62
MechanicalDryConditionedUnitTest Method
Tensile Modulus (23°C)28001100MPaISO 527-2/1
Tensile Stress (Yield, 23°C)75.035.0MPaISO 527-2/50
Tensile Strain (Yield, 23°C)4.025%ISO 527-2/50
Nominal Tensile Strain at Break (23°C)70180%ISO 527-2/50
Flexural Modulus 1(23°C)2400600MPaISO 178
Flexural Stress 2(23°C)97.025.0MPaISO 178
ImpactDryConditionedUnitTest Method
Charpy Notched Impact Strength ISO 179/1eA
     -30°C 5.0--kJ/m²ISO 179/1eA
     23°C 8.0 kJ/m²No BreakISO 179/1eA
Charpy Unnotched Impact Strength (23°C)No BreakNo BreakISO 179/1eU
ThermalDryConditionedUnitTest Method
Heat Deflection Temperature
     0.45 MPa, not annealed 150--°CISO 75-2/B
     1.8 MPa, not annealed 60.0--°CISO 75-2/A
Melting Temperature (DSC) 3222--°CISO 3146
Linear thermal expansion coefficient ISO 11359-2
     Flow : 23 to 80°C 7.0E-5--cm/cm/°CISO 11359-2
     Lateral : 23 to 80°C 1.0E-4--cm/cm/°CISO 11359-2
ElectricalDryConditionedUnitTest Method
Surface Resistivity 1.0E+131.0E+10ohmsIEC 60093
Volume Resistivity 1.0E+151.0E+13ohms·cmIEC 60093
Dielectric Constant (1 MHz)3.506.50IEC 60250
Dissipation Factor (1 MHz)0.0250.25IEC 60250
Comparative Tracking Index 600--VIEC 60112
FlammabilityDryConditionedUnitTest Method
Flame Rating (1.50 mm)HB--UL 94
InjectionDryUnit
Drying Temperature < 80.0°C
Drying Time 4.0 - 6.0hr
Processing (Melt) Temp 250 - 270°C
Mold Temperature 40.0 - 80.0°C
Injection Rate Moderate-Fast
Injection instructions
Back pressure: moderate
Note Message
1 .2.0 mm/min
2 .2.0 mm/min
3 .10°C/min
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