Ablebond 84-1LMI

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Henkel Ablestik
Trademark: Ablebond
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: LagH7y_Ablebond-84-1LMI.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
Wechat: WECHAT
Message
ABLEBOND® 84-1LMI die attach adhesive is designed for microelectronic chip bonding. This adhesive is ideal for application by automatic dispenser or hand probe.

ABLEBOND® 84-1LMI meets the requirements of MIL-STD-883, Method 5011.
General Information
Filler / Reinforcement
  • Silver
Features
  • Electrically Conductive
  • Low to No Outgassing
Uses
  • Adhesives
Agency Ratings
  • MIL Std. 883 Method 5011
Appearance
  • Silver
Forms
  • Paste
PhysicalNominal ValueUnit
pH 5.5
Viscosity - Brookfield CP51 1(25°C)30.0Pa·s
Additional InformationNominal ValueUnit
Ionic Chloride < 20ppm
Ionic Potassium < 10ppm
Ionic Sodium < 20ppm
Lap Shear - Al to Al (25°C)12.0MPa
Shear Strength - Ag/Cu leadframe (Die) 2(25°C)186N
Thixotropic Index 34.00
Water Extract Conductivity 10.0µS/cm
Weight Loss on Heating (300°C)0.19%
Work Life (25°C)14.0day
ThermalNominal ValueUnitTest Method
Glass Transition Temperature 103°C
CLTE - Flow
    < 103°C 5.5E-5cm/cm/°C
    > 103°C 1.5E-4cm/cm/°C
Thermal Conductivity 2.4W/m/KASTM C177
ElectricalNominal ValueUnit
Volume Resistivity 5.0E-4ohms·cm
ThermosetNominal ValueUnit
Shelf Life
    -40°C 52wk
    -10°C 26wk
    5°C 13wk
Post Cure Time
    125°C 2.0hr
    150°C 1.0hr
Note Message
1 .Speed 5 rpm
2 .2 X 2 mm Si die
3 .(0.5/5 rpm
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