| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Henkel Ablestik |
| Trademark: | Ablebond |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | LagH7y_Ablebond-84-1LMI.pdf |
| PRICE: | Order Products email sales@su-jiao.com |
| Message |
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ABLEBOND® 84-1LMI die attach adhesive is designed for microelectronic chip bonding. This adhesive is ideal for application by automatic dispenser or hand probe. ABLEBOND® 84-1LMI meets the requirements of MIL-STD-883, Method 5011. |
| General Information | |
|---|---|
| Filler / Reinforcement |
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| Features |
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| Uses |
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| Agency Ratings |
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| Appearance |
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| Forms |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| pH | 5.5 | ||
| Viscosity - Brookfield CP51 1(25°C) | 30.0 | Pa·s |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Ionic Chloride | < 20 | ppm | |
| Ionic Potassium | < 10 | ppm | |
| Ionic Sodium | < 20 | ppm | |
| Lap Shear - Al to Al (25°C) | 12.0 | MPa | |
| Shear Strength - Ag/Cu leadframe (Die) 2(25°C) | 186 | N | |
| Thixotropic Index 3 | 4.00 | ||
| Water Extract Conductivity | 10.0 | µS/cm | |
| Weight Loss on Heating (300°C) | 0.19 | % | |
| Work Life (25°C) | 14.0 | day |
| Thermal | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Glass Transition Temperature | 103 | °C | |
| CLTE - Flow | |||
| < 103°C | 5.5E-5 | cm/cm/°C | |
| > 103°C | 1.5E-4 | cm/cm/°C | |
| Thermal Conductivity | 2.4 | W/m/K | ASTM C177 |
| Electrical | Nominal Value | Unit | |
|---|---|---|---|
| Volume Resistivity | 5.0E-4 | ohms·cm |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Shelf Life | |||
| -40°C | 52 | wk | |
| -10°C | 26 | wk | |
| 5°C | 13 | wk | |
| Post Cure Time | |||
| 125°C | 2.0 | hr | |
| 150°C | 1.0 | hr |
| Note Message | |
|---|---|
| 1 . | Speed 5 rpm |
| 2 . | 2 X 2 mm Si die |
| 3 . | (0.5/5 rpm |
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| DURAFIDE® 1140A1 | Polyplastics Co., Ltd. | PPS | DURAFIDE® |
| POLYCOMPO PE 20100J | POLYCOMPO Co.,Ltd. | LLDPE | POLYCOMPO PE |