Category: | Epoxy , Epoxy; Epoxide |
Manufacturer: | Henkel Ablestik |
Trademark: | Ablebond |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | LagH7y_Ablebond-84-1LMI.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
Message |
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ABLEBOND® 84-1LMI die attach adhesive is designed for microelectronic chip bonding. This adhesive is ideal for application by automatic dispenser or hand probe. ABLEBOND® 84-1LMI meets the requirements of MIL-STD-883, Method 5011. |
General Information | |
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Filler / Reinforcement |
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Features |
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Uses |
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Agency Ratings |
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Appearance |
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Forms |
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Physical | Nominal Value | Unit | |
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pH | 5.5 | ||
Viscosity - Brookfield CP51 1(25°C) | 30.0 | Pa·s |
Additional Information | Nominal Value | Unit | |
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Ionic Chloride | < 20 | ppm | |
Ionic Potassium | < 10 | ppm | |
Ionic Sodium | < 20 | ppm | |
Lap Shear - Al to Al (25°C) | 12.0 | MPa | |
Shear Strength - Ag/Cu leadframe (Die) 2(25°C) | 186 | N | |
Thixotropic Index 3 | 4.00 | ||
Water Extract Conductivity | 10.0 | µS/cm | |
Weight Loss on Heating (300°C) | 0.19 | % | |
Work Life (25°C) | 14.0 | day |
Thermal | Nominal Value | Unit | Test Method |
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Glass Transition Temperature | 103 | °C | |
CLTE - Flow | |||
< 103°C | 5.5E-5 | cm/cm/°C | |
> 103°C | 1.5E-4 | cm/cm/°C | |
Thermal Conductivity | 2.4 | W/m/K | ASTM C177 |
Electrical | Nominal Value | Unit | |
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Volume Resistivity | 5.0E-4 | ohms·cm |
Thermoset | Nominal Value | Unit | |
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Shelf Life | |||
-40°C | 52 | wk | |
-10°C | 26 | wk | |
5°C | 13 | wk | |
Post Cure Time | |||
125°C | 2.0 | hr | |
150°C | 1.0 | hr |
Note Message | |
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1 . | Speed 5 rpm |
2 . | 2 X 2 mm Si die |
3 . | (0.5/5 rpm |
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