| Category: | PI, TS , Thermoset Polyimide |
| Manufacturer: | Cytec Industries Inc. |
| Trademark: | FM® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | LFKQge_FM-50.pdf |
| PRICE: | Order Products email sales@su-jiao.com |
| Message |
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FM® 50 is a non-MDA-based polyimide foam material intended for core-splicing applications requiring 500 - 600°F (260 - 316°C) service. FM 50 may be cured in place with either a free or restrained foaming process. It contains no metallic fillers. Suggested Applications: High temperature core splice and edge sealing applications |
| General Information | |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Specific Gravity | 1.06 | g/cm³ |
| Mechanical | Nominal Value | Unit | |
|---|---|---|---|
| Shear Strength 1(24°C) | 0.655 | MPa |
| Cured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Lap Shear Strength 2(24°C) | 8.27 | MPa |
| Note Message | |
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| 1 . | Tube Shear |
| 2 . | Tested on 6Al-4V Titanium |
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|---|---|---|---|
| BCC Resins HPX-825 | BCC Products Inc. | TS, Unspecified | BCC Resins |
| Cardia Biohybrid鈩?BL-M | Cardia Bioplastics™ | TPS+PP | Cardia Biohybrid™ |
| ENSOFT SL-300-80A | ENPLAST, a Ravago Group Company | TPE | ENSOFT |
| Lucent PA 66-41 | Lucent Polymers, Inc. | Nylon 66 | Lucent PA |
| LNP™ THERMOCOMP™ EX93452 compound | SABIC Innovative Plastics | PEI | LNP™ THERMOCOMP™ |