Bakelite® PF 2535

Category: Phenolic , Phenolic
Manufacturer: Hexion Inc.
Trademark: Bakelite®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: Kt8p0h_Bakelite-PF-2535.pdf
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Product Description
Phenolic moulding compound, inorganically/organically filled, average heat resistant, steam resistant, dishwasher proof, high surface quality

Application Areas
Fittings for ovens and dishwashers, tableware/cutlery handles, cookware fittings
General Information
Filler / Reinforcement
  • Organic\Inorganic
Features
  • Good Surface Finish
  • Steam Resistant
Uses
  • Cookware
  • Fittings
  • Handles
Processing Method
  • Compression Molding
  • Injection Molding
PhysicalNominal ValueUnitTest Method
Density (23°C)1.50g/cm³ISO 1183
Apparent Density 0.70g/cm³ISO 60
Molding Shrinkage 10.80%ISO 2577
Water Absorption - 24h/23C 45.0mgISO 62
Post Shrinkage 20.45%ISO 2577
Additional InformationNominal ValueUnit
Compression Molding Molding Pressure > 15.0MPa
Compression Molding Temperature 160 to 190°C
MechanicalNominal ValueUnitTest Method
Tensile Modulus 8500MPaISO 527-2/1
Tensile Stress 55.0MPaISO 527-2/5
Flexural Modulus 8500MPaISO 178
Flexural Stress 390.0MPaISO 178
Compressive Stress 250MPaISO 604
ImpactNominal ValueUnitTest Method
Charpy Notched Impact Strength (23°C)1.7kJ/m²ISO 179/1eA
Charpy Unnotched Impact Strength (23°C)6.5kJ/m²ISO 179/1eU
ThermalNominal ValueUnitTest Method
Heat Deflection Temperature (8.0 MPa, Unannealed)115°CISO 75-2/C
ElectricalNominal ValueUnitTest Method
Surface Resistivity 1.0E+11ohmsIEC 60093
Volume Resistivity 1.0E+12ohms·cmIEC 60093
Relative Permittivity (100 Hz)12.5IEC 60250
Dissipation Factor (100 Hz)0.30IEC 60250
InjectionNominal ValueUnit
Rear Temperature 60.0 to 75.0°C
Nozzle Temperature 80.0 to 100°C
Processing (Melt) Temp 80.0 to 100°C
Mold Temperature 160 to 190°C
Injection Pressure > 15.0MPa
Back Pressure 0.500 to 2.00MPa
Note Message
1 .Injection
2 .Injection
3 .2.0 mm/min
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