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EPO-TEK® 730-110 Black
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | Kf5WuI_EPO-TEK-730-110-Black.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| A two component, room temperature curing, general and structural grade epoxy. It can be used for adhesive, sealing, and encapsulating applications in medical, x-ray device, filtration, opto-electronics and PCB industries. It is a black version of EPO-TEK 730-110. |
| General Information | |
|---|---|
| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Processing Method |
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| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 50.0 | °C | |
| CLTE - Flow | |||
| -- 2 | 6.1E-5 | cm/cm/°C | |
| -- 3 | 1.9E-4 | cm/cm/°C |
| Optical | Nominal Value | Unit | |
|---|---|---|---|
| Transmittance | |||
| 300 to 960 nm | < 2.0 | % | |
| 980 to 1260 nm | < 5.0 | % |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Thermoset Components | |||
| Part A | Mix Ratio by Weight: 1.0 | ||
| Part B | Mix Ratio by Weight: 1.0 | ||
| Shelf Life (23°C) | 52 | wk |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Degradation Temperature | 343 | °C | |
| Die Shear Strength - >10 kg (23°C) | 23.4 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 150 | °C | |
| Intermittent | -55 to 250 | °C | |
| Storage Modulus | 896 | MPa | |
| Weight Loss on Heating (200°C) | 1.0 | % |
| Uncured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Color | |||
| -- 4 | Black | ||
| -- 5 | Yellow | ||
| Density | |||
| Part B | 0.968 | g/cm³ | |
| Part A | 1.17 | g/cm³ | |
| Viscosity 6(23°C) | 10 to 14 | Pa·s | |
| Curing Time (80°C) | 2.0 | hr | |
| Pot Life | 60 | min |
| Cured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Shore Hardness (Shore D) | 76 | ||
| Lap Shear Strength (23°C) | > 13.8 | MPa | |
| Relative Permittivity (1 kHz) | 3.24 | ||
| Volume Resistivity (23°C) | > 4.0E+13 | ohms·cm | |
| Dissipation Factor (1 kHz) | 9.0E-3 |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | Part A |
| 5 . | Part B |
| 6 . | 20 rpm |
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|---|---|---|---|
| DJSilicone NE-9350 | DONGJUE SILICONE (NANJING) CO., LTD | Silicone | DJSilicone |
| Kingfa JH-R2G10 P60 | Kingfa | PC+ABS | Kingfa |
| Hostacom TRC 511N | LyondellBasell Industries | PP, Unspecified | Hostacom |
| Hostaform® C 9021 GV1/20 | Celanese Corporation | Acetal (POM) Copolymer | Hostaform® |
| TPV Elastoprene® N73A-E01 | Elastómeros Riojanos S.A. | PP+EPDM | TPV Elastoprene® |
