EPO-TEK® H70E-2LC

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Epoxy Technology Inc.
Trademark: EPO-TEK®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: KcSycn_EPO-TEK-H70E-2LC.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
Wechat: WECHAT
Message
A two component, thermally conductive, electrically insulating epoxy designed for glob-top chip protection in TAB and COB die-attach technologies. It is used to prevent chips from being mechanically damaged during micro-package assembly and handling.
General Information
Features
  • Electrically Insulating
  • Thermally Conductive
  • Thixotropic
Uses
  • Adhesives
  • Electrical/Electronic Applications
Agency Ratings
  • EC 1907/2006 (REACH)
  • EU 2003/11/EC
  • EU 2006/122/EC
RoHS Compliance
  • RoHS Compliant
Forms
  • Paste
PhysicalNominal ValueUnit
Ion Type - Cl- 194ppm
Particle Size < 50.0µm
Additional InformationNominal ValueUnit
Degradation Temperature 400°C
Die Shear Strength - >10 kg (23°C) 23.4MPa
Operating Temperature
    Continuous -55 to 175°C
    Intermittent -55 to 350°C
Storage Modulus (23°C) 6.37GPa
Thixotropic Index 3.26
Weight Loss on Heating (250°C) 0.67%
ThermalNominal ValueUnit
Glass Transition Temperature 1> 60.0°C
CLTE - Flow
    -- 21.8E-5cm/cm/°C
    -- 37.5E-5cm/cm/°C
Thermal Conductivity 0.79W/m/K
ThermosetNominal ValueUnit
Thermoset Components
    Part A Mix Ratio by Weight: 1.0
    Part B Mix Ratio by Weight: 1.0
Shelf Life (23°C)52wk
Uncured PropertiesNominal ValueUnit
Color
    -- 4Black
    -- 5Cream
Density
    Part A 1.63g/cm³
    Part B 2.30g/cm³
Viscosity 6(23°C)6.5 to 9.5Pa·s
Curing Time (150°C)1.0hr
Pot Life 3600min
Cured PropertiesNominal ValueUnit
Shore Hardness (Shore D)72
Lap Shear Strength (23°C)13.6MPa
Relative Permittivity (1 kHz)5.05
Volume Resistivity (23°C)> 1.5E+13ohms·cm
Dissipation Factor (1 kHz)6.6E-3
Note Message
1 .Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min
2 .Below Tg
3 .Above Tg
4 .Part A
5 .Part B
6 .20 rpm
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