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Huafon JF-W-H3060P
| Category: | PUR, Unspecified , Polyurethane |
| Manufacturer: | Huafon Group Co., Ltd. |
| Trademark: | Huafon |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | KSmiMQ_Huafon-JF-W-H3060P.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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High Peeling Strength Type Characteristics Mid hard type, embossing resin, uniform cell structure, high peeling strength, suit for high peeling and cold embossing technology. Applications Shoes, Bags |
| General Information | |
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| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Solvents | DMF |
| Uncured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Solids Content | 29 to 31 | % | |
| Viscosity (25°C) | 180 to 260 | Pa·s |
| Cured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Tensile Modulus (100% Secant) | 5.50 to 6.50 | MPa | |
| Tensile Strength | > 30.0 | MPa | |
| Tensile Elongation at Break | > 450 | % |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| Spartech Polycom 3030-10004 | Spartech Polycom | PVC Alloy | Spartech |
| Unichem 6574 | Colorite Polymers | PVC, Unspecified | Unichem |
| DENISAB 0513 | Vamp Tech | ABS | DENISAB |
| Elastron® G G601.A50.B | Elastron USA, Inc. | SEBS | Elastron® G |
| KOPLA PA66 KDE1030 | KOPLA Co., Ltd. | Nylon 66 | KOPLA PA66 |
