| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Sumitomo Bakelite Co., Ltd. |
| Trademark: | Sumikon® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | KLS6z7_Sumikon-EME-S325.pdf |
| PRICE: | Order Products email sales@su-jiao.com |
| Message |
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| EME-S325 is a low alpha particle epoxy molding compound. |
| General Information | |
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| Features |
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| Uses |
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| Forms |
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| Processing Method |
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| Physical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Specific Gravity | 2.00 | g/cm³ | ASTM D792 |
| Water Absorption (24 hr) | 0.18 | % | ASTM D570 |
| Mechanical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Flexural Modulus (25°C) | 22600 | MPa | ASTM D790 |
| Flexural Strength (25°C) | 177 | MPa | ASTM D790 |
| Thermal | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Glass Transition Temperature | 135 | °C | ASTM E1356 |
| Thermal Conductivity | 0.88 | W/m/K | ASTM C177 |
| Electrical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Volume Resistivity | 1.0E+13 | ohms·cm | ASTM D257 |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Demold Time (175°C) | 1.2 - 2.0 | min | |
| Post Cure Time (175°C) | 4.0 - 10 | hr |
| Additional Information |
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| Spiral Flow, SB-U-03-003: 80 cmGel Time, SB-U-03-005, 175°C: 30 secThermal Expansion, SB-U-02-002, T |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| RTP 1385 D | RTP Company | PPS | RTP |
| Geon™ Vinyl Flexible 86479 Tran | PolyOne Corporation | PVC, Flexible | Geon™ Vinyl Flexible |
| Elvax® 360 | DuPont Packaging & Industrial Polymers | EVA | Elvax® |
| Hanwha Total PP RB73 | HANWHA TOTAL PETROCHEMICALS Co., Ltd. | PP, Unspecified | Hanwha Total PP |
| Wanthane® WHT-1185D | Wanhua Chemical Group Co., Ltd. | TPU-Polyester | Wanthane® |