Vyncolit® TEM 9053

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Vyncolit N.V.
Trademark: Vyncolit®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: K4Obfd_Vyncolit-TEM-9053.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
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TEM 9053 is a short fiberglass and mineral filled, toughened, epoxy molding compound, with excellent dimensional stability and high strength properties.
General Information
Filler / Reinforcement
  • Glass \Mineral
Features
  • Good dimensional stability
  • The degassing effect is low to no
  • Low viscosity
  • High strength
  • Solvent resistance
  • Anti-salt water/fog
  • Good thermal shock resistance
  • Good chemical resistance
  • alkali resistance
  • acid resistance
  • Good toughness
  • Non-corrosive
Uses
  • Electrical components
  • Military application
  • Connector
Agency Ratings
  • FDA not rated
  • USDA Unspecified Approval
Appearance
  • Black
Forms
  • Particles
Processing Method
  • Resin transfer molding
  • Compression molding
  • Injection molding
PhysicalNominal ValueUnitTest Method
Specific Gravity 1.95g/cm³ASTM D792
Molding Shrinkage - Flow (Compression Molded)0.25%ASTM D955
HardnessNominal ValueUnitTest Method
Rockwell Hardness (M-Scale)70ASTM D785
MechanicalNominal ValueUnitTest Method
Tensile Strength (Break, Compression Molded)97.0MPaASTM D638
Flexural Modulus (Compression Molded)16600MPaASTM D790
Flexural Strength (Break)160MPaASTM D790
Compressive Strength 235MPaASTM D695
ImpactNominal ValueUnitTest Method
Notched Izod Impact (Compression Molded)24J/mASTM D256
ThermalNominal ValueUnitTest Method
Deflection Temperature Under Load (1.8 MPa, Unannealed, Compression Molded)160°CASTM D648
CLTE - Flow 2.6E-5cm/cm/°CASTM E831
Thermal Conductivity 0.71W/m/KASTM C177
ElectricalNominal ValueUnitTest Method
Dielectric Strength 113kV/mmASTM D149
Dielectric Constant (1 MHz)4.20ASTM D150
Dissipation Factor (1 MHz)0.015ASTM D150
Arc Resistance 180secASTM D495
InjectionNominal ValueUnit
Middle Temperature 60.0 - 82.2°C
Nozzle Temperature 82.2 - 93.3°C
Processing (Melt) Temp 93.3 - 116°C
Mold Temperature 149 - 177°C
Injection Pressure 34.5 - 68.9MPa
Holding Pressure 13.8 - 34.5MPa
Back Pressure 0.345MPa
Injection instructions
Gauge: 0.3The value listed as Thermal Conductivity, ASTM C177, was tested in accordance with ASTM C518.Powder Density, ASTM D1895: 0.85 g/cm³Water Absorption, ASTM D570, 48 hrs, 50°C: 0.23%DTUL @264psi - Unannealed, ASTM D648, Post Baked, Compression Molded: 160°CDielectric Strength, ASTM D149, 60 Hz, Method B, wet: 12.8 kV/mmDielectric Constant, ASTM D150, 1000000 Hz, wet: 4.2Dissipation Factor, ASTM D150, 1000000 Hz, wet: 0.015Compression and Transfer Molding Conditions: Preheat Temperature: 180 to 225 °F Mold Temperature: 325 to 370 °F Compression Mold Pressure: 1000 to 5000 psi Transfer Mold Pressure: 1500 to 8000 psi Cure Time, 0.125 in: 60 to 90 sec
Note Message
1 .Method B (step by step)
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