TRIBOCOMP® PA66 GF40 TS0

Category: Nylon 66 , Polyamide 66
Manufacturer: EPIC Polymers
Trademark: TRIBOCOMP®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: IcaPCR_TRIBOCOMP-PA66-GF40-TS0.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
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TRIBOCOMP®PA66 GF40 TS0 is a polyamide 66 (nylon 66) product, which contains 15% ptfe fiber and 40% glass fiber reinforcement. It is available in Europe. The main characteristics are: lubrication.
General Information
Filler / Reinforcement
  • PTFE fiber, 15% filler by weight
  • Glass fiber reinforced material, 40% filler by weight
Additive
  • PTFE lubricant (15%)
Forms
  • Particle
PhysicalNominal ValueUnitTest Method
Density 1.61g/cm³ISO 1183
Molding Shrinkage - Flow 0.30%ISO 294-4
Water Absorption (Equilibrium, 23°C, 50% RH)1.2%ISO 62
MechanicalNominal ValueUnitTest Method
Tensile Modulus (23°C)12000MPaISO 527-2
Tensile Stress (Break, 23°C)185MPaISO 527-2
Tensile Strain (Break)2.0%ISO 527-2
Flexural Modulus (23°C)11000MPaISO 178
Flexural Stress (23°C)260MPaISO 178
Coefficient of Friction ASTM D3702
    Dynamic 0.27ASTM D3702
    Static 0.22ASTM D3702
Wear Factor 13.0ASTM D3702
ImpactNominal ValueUnitTest Method
Charpy Notched Impact Strength (23°C)14kJ/m²ISO 179
Charpy Unnotched Impact Strength (23°C)48kJ/m²ISO 179
ThermalNominal ValueUnitTest Method
Heat Deflection Temperature
    0.45 MPa, not annealed 252°CISO 75-2/B
    1.8 MPa, not annealed 250°CISO 75-2/A
CLTE - Flow (23°C)2.7E-5cm/cm/°CISO 7991
Thermal Conductivity 0.31W/m/KISO 22007
ElectricalNominal ValueUnitTest Method
Surface Resistivity 1.0E+12ohmsASTM D257
Dielectric Strength (2.00 mm)37kV/mmIEC 60243-1
Comparative Tracking Index 500VIEC 60112
Additional Information
The value listed as Molding Shrinkage ISO 294-4, was tested in accordance with S.O.P. methods.
InjectionNominal ValueUnit
Drying Temperature 80.0°C
Drying Time 4.0hr
Suggested Max Moisture 0.10%
Rear Temperature 270 - 300°C
Middle Temperature 275 - 295°C
Front Temperature 280 - 295°C
Nozzle Temperature 290 - 310°C
Processing (Melt) Temp < 300°C
Mold Temperature 80.0 - 130°C
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