Category: | Epoxy , Epoxy; Epoxide |
Manufacturer: | Henkel Ablestik |
Trademark: | Ablebond |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | INDokZ_Ablebond-84-1LMIT1.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
Message |
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ABLEBOND® 84-1LMIT1 adhesive is designed for die attach applications. It is designed for screen printing using 325 mesh. ABLEBOND® 84-1LMIT1 meets the requirements of MIL-STD-883C, Method 5011. |
General Information | |
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Filler / Reinforcement |
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Features |
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Uses |
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Agency Ratings |
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Appearance |
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Forms |
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Physical | Nominal Value | ||
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pH | 4.5 |
Fill Analysis | Nominal Value | Unit | |
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Brookfield Viscosity - CP51 1(25°C) | 22.0 | Pa·s |
Additional Information | Nominal Value | Unit | |
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Ionic Chloride | < 200 | ppm | |
Ionic Potassium | < 50 | ppm | |
Ionic Sodium | < 50 | ppm | |
Lap Shear - Al to Al (25°C) | 13.0 | MPa | |
Shear Strength - Die (Au) 2(25°C) | 186 | N | |
Water Extract Conductivity | 13.0 | µS/cm | |
Weight Loss on Heating (300°C) | 0.16 | % | |
Work Life (25°C) | 14.0 | day |
Mechanical | Nominal Value | Unit | |
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Tensile Modulus | |||
-65°C | 1200 | MPa | |
25°C | 1100 | MPa | |
100°C | 790 | MPa | |
150°C | 78.0 | MPa | |
200°C | 56.0 | MPa | |
250°C | 67.0 | MPa |
Thermal | Nominal Value | Unit | Test Method |
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Glass Transition Temperature | 103 | °C | |
CLTE - Flow | |||
< 103°C | 5.0E-5 | cm/cm/°C | |
> 103°C | 2.0E-4 | cm/cm/°C | |
Thermal Conductivity | 3.6 | W/m/K | ASTM C177 |
Electrical | Nominal Value | Unit | |
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Volume Resistivity | 5.0E-4 | ohms·cm |
Thermoset | Nominal Value | Unit | |
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Shelf Life (-40°C) | 52 | wk | |
Post Cure Time | |||
125°C | 2.0 | hr | |
150°C | 1.0 | hr |
Note Message | |
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1 . | Speed 5 rpm |
2 . | 2 X 2 mm Au die |
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Eleme NGH200IG | Eleme Petrochemical Company Ltd | HDPE | Eleme |