Order Products : sales@su-jiao.com
EPO-TEK® E2036
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | I3ST0k_EPO-TEK-E2036.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
Wechat:
| Message |
|---|
| A two component, slightly flexible, silver-filled, electrically conductive adhesive for semiconductor and electronic assemblies. It is a low Tg epoxy, intended for many kinds of electronics at the PCB level, flex circuitry, or optical and medical devices. It can be used for resisting thermal cycles, high vibration applications or resisting PCB drop tests. |
| General Information | |
|---|---|
| Filler / Reinforcement |
|
| Features |
|
| Uses |
|
| Agency Ratings |
|
| RoHS Compliance |
|
| Forms |
|
| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Ion Type | |||
| Cl- | 422 | ppm | |
| K+ | 8 | ppm | |
| Na+ | 1 | ppm | |
| NH4+ | 159 | ppm | |
| Particle Size | < 20.0 | µm |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Degradation Temperature | 444 | °C | |
| Die Shear Strength - >5 kg (23°C) | 11.7 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 250 | °C | |
| Intermittent | -55 to 350 | °C | |
| Storage Modulus (23°C) | 4.40 | GPa | |
| Thixotropic Index | 3.95 | ||
| Weight Loss on Heating | |||
| 200°C | 0.13 | % | |
| 250°C | 0.32 | % | |
| 300°C | 0.65 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 30.0 | °C | |
| CLTE - Flow | |||
| -- 2 | 3.9E-5 | cm/cm/°C | |
| -- 3 | 1.8E-4 | cm/cm/°C | |
| Thermal Conductivity | 1.5 | W/m/K |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Thermoset Components | |||
| Part A | Mix Ratio by Weight: 3.0 | ||
| Part B | Mix Ratio by Weight: 1.0 | ||
| Shelf Life (23°C) | 52 | wk |
| Uncured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Color | |||
| -- 4 | Silver | ||
| -- 5 | Silver | ||
| Density | |||
| Part A | 2.80 | g/cm³ | |
| Part B | 3.51 | g/cm³ | |
| Viscosity 6(23°C) | 10 to 20 | Pa·s | |
| Curing Time (150°C) | 1.0 | hr | |
| Pot Life | 5000 | min |
| Cured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Shore Hardness (Shore D) | 75 | ||
| Lap Shear Strength (23°C) | 10.3 | MPa | |
| Volume Resistivity (23°C) | < 3.0E-4 | ohms·cm |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | Part B |
| 5 . | Part A |
| 6 . | 20 rpm |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| Sanren F850EBA (On-spec.) | SINOPEC Shanghai Petrochemical Co. Ltd. | PP Homopolymer | Sanren |
| Advanced Composites ATX913-2 | Advanced Composites, Inc. | PP, Unspecified | Advanced Composites |
| Braskem PE LF-0720/21AF | Braskem | LLDPE | Braskem PE |
| Chemraz 592 | Greene, Tweed & Co. | Perfluoroelastomer | Chemraz |
| COSMOPLENE® FL7016G | TPC, The Polyolefin Company (Singapore) Pte Ltd | PP Homopolymer | COSMOPLENE® |
