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EPO-TEK® 930
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | Hp7UBf_EPO-TEK-930.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| Message |
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| A two-part thermally conductive epoxy for heat sinking electronics and hybrids. It can be used at the PCB level for circuit assembly. |
| General Information | |
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| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Particle Size | < 500 | µm |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Degradation Temperature | 350 | °C | |
| Die Shear Strength - >5 kg (23°C) | 11.7 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 150 | °C | |
| Intermittent | -55 to 250 | °C | |
| Storage Modulus (23°C) | 9.06 | GPa | |
| Weight Loss on Heating (300°C) | 0.86 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 90.0 | °C | |
| CLTE - Flow | |||
| -- 2 | 1.6E-5 | cm/cm/°C | |
| -- 3 | 8.1E-5 | cm/cm/°C | |
| Thermal Conductivity | 4.6 | W/m/K |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Thermoset Components | |||
| Part A | Mix Ratio by Weight: 100 | ||
| Part B | Mix Ratio by Weight: 3.3 | ||
| Shelf Life (23°C) | 52 | wk |
| Uncured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Color | |||
| -- 4 | Amber | ||
| -- 5 | White | ||
| Density | |||
| Part B | 1.02 | g/cm³ | |
| Part A | 1.66 | g/cm³ | |
| Viscosity (23°C) | > 820 | Pa·s | |
| Curing Time (150°C) | 1.0 | hr | |
| Pot Life | 360 | min |
| Cured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Shore Hardness (Shore D) | 82 | ||
| Lap Shear Strength (23°C) | 4.54 | MPa | |
| Relative Permittivity (1 kHz) | 3.96 | ||
| Volume Resistivity (23°C) | > 2.0E+13 | ohms·cm | |
| Dissipation Factor (1 kHz) | 6.0E-3 |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | Part B |
| 5 . | Part A |
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