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EPO-TEK® H75
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | HYRp0H_EPO-TEK-H75.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| A two component, high Tg, thermally conductive, electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic assemblies. It may be considered a higher viscosity alternative to EPO-TEK® H74. |
| General Information | |
|---|---|
| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Particle Size | < 50.0 | µm |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Degradation Temperature | 416 | °C | |
| Die Shear Strength - >20 kg (23°C) | 46.9 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 250 | °C | |
| Intermittent | -55 to 350 | °C | |
| Storage Modulus (23°C) | 6.52 | GPa | |
| Weight Loss on Heating | |||
| 200°C | < 0.050 | % | |
| 250°C | 0.080 | % | |
| 300°C | 0.20 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 100 | °C | |
| CLTE - Flow | |||
| -- 2 | 2.9E-5 | cm/cm/°C | |
| -- 3 | 9.0E-5 | cm/cm/°C | |
| Thermal Conductivity | 0.66 | W/m/K |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Thermoset Components | |||
| Part A | Mix Ratio by Weight: 100 | ||
| Part B | Mix Ratio by Weight: 3.3 | ||
| Shelf Life (23°C) | 52 | wk |
| Uncured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Color | |||
| -- 4 | Amber | ||
| -- 5 | Grey | ||
| Density | |||
| Part B | 1.02 | g/cm³ | |
| Part A | 2.26 | g/cm³ | |
| Viscosity 6(23°C) | 300 to 400 | Pa·s | |
| Curing Time (150°C) | 1.0 | hr | |
| Pot Life | 180 | min |
| Cured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Shore Hardness (Shore D) | 95 | ||
| Lap Shear Strength (23°C) | 13.0 | MPa | |
| Relative Permittivity (1 kHz) | 5.37 | ||
| Volume Resistivity (23°C) | > 2.0E+12 | ohms·cm | |
| Dissipation Factor (1 kHz) | 8.0E-3 |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | Part B |
| 5 . | Part A |
| 6 . | 0.5 rpm |
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|---|---|---|---|
| TOTAL Polystyrene 3241 | TOTAL Refining & Chemicals | PS (HIPS) | TOTAL Polystyrene |
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| Devcon HP 250 | Devcon | Epoxy | Devcon |
| Geon™ HC 2155 | PolyOne Corporation | PVC, Flexible | Geon™ HC |
| Sylvin 9077-94 Grey 9599 | Sylvin Technologies Incorporated | PVC, Unspecified | Sylvin |
