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EPO-TEK® H21D
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | H88UVc_EPO-TEK-H21D.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| Message |
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| EPO-TEK® H21D is a two component, high Tg, silver-filled epoxy designed for chip bonding in microelectronic and optoelectronic applications. |
| General Information | |
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| Filler / Reinforcement |
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| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Ion Type | |||
| Cl- | 64 | ppm | |
| Na+ | 72 | ppm | |
| NH4+ | 121 | ppm | |
| Particle Size | < 45.0 | µm |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Degradation Temperature | 416 | °C | |
| Die Shear Strength - >10 kg (23°C) | 23.4 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 250 | °C | |
| Intermittent | -55 to 350 | °C | |
| Storage Modulus | 5.53 | GPa | |
| Thixotropic Index | 2.60 | ||
| Weight Loss on Heating | |||
| 200°C | 0.030 | % | |
| 250°C | 0.060 | % | |
| 300°C | 0.17 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 100 | °C | |
| CLTE - Flow | |||
| -- 2 | 4.2E-5 | cm/cm/°C | |
| -- 3 | 2.3E-4 | cm/cm/°C | |
| Thermal Conductivity | 1.0 | W/m/K |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Thermoset Components | |||
| Part A | Mix Ratio by Weight: 10 | ||
| Part B | Mix Ratio by Weight: 1.0 | ||
| Shelf Life (23°C) | 52 | wk |
| Uncured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Color | |||
| -- 4 | Silver | ||
| -- 5 | Silver | ||
| Density | |||
| Part B | 2.13 | g/cm³ | |
| Part A | 2.44 | g/cm³ | |
| Viscosity 6(23°C) | 14 to 20 | Pa·s | |
| Curing Time (150°C) | 1.0 | hr | |
| Pot Life | 900 | min |
| Cured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Shore Hardness (Shore D) | 60 | ||
| Lap Shear Strength (23°C) | 10.4 | MPa | |
| Volume Resistivity (23°C) | < 9.0E-4 | ohms·cm |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | Part B |
| 5 . | Part A |
| 6 . | 20 rpm |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| RTP 207 FR | RTP Company | Nylon 66 | RTP |
| SWANCOR Epoxy 900 | SWANCOR IND. CO., LTD. | Epoxy | SWANCOR Epoxy |
| TRANSMARE® 14CT40-0.002 | Transmare Compounding B.V. | PP Copolymer | TRANSMARE® |
| ESTAPROP 1040 V2 K | Cossa Polimeri S.r.l. | PP Copolymer | ESTAPROP |
| OTECH PVC OC5014-Boot | OTECH Corporation | PVC, Unspecified | OTECH PVC |
