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EPO-TEK® H74-110
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | FWFzvG_EPO-TEK-H74-110.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| A two component, electrically and thermally insulating epoxy adhesive designed for semiconductor, electronics, medical, and optical applications. It is an IR transparent version of EPO-TEK H74 which enables fiber optic and photonic packaging. Due to its low viscosity, it is useful for sealing, potting and encapsulation projects. |
| General Information | |
|---|---|
| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Processing Method |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Ion Type | |||
| Cl- | 329 | ppm | |
| K+ | 5 | ppm | |
| NH4+ | 409 | ppm |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Degradation Temperature | 494 | °C | |
| Die Shear Strength - >15 kg (23°C) | 35.2 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 250 | °C | |
| Intermittent | -55 to 350 | °C | |
| Storage Modulus | 3.86 | GPa | |
| Weight Loss on Heating | |||
| 200°C | 0.050 | % | |
| 250°C | 0.030 | % | |
| 300°C | 0.070 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 90.0 | °C | |
| CLTE - Flow | |||
| -- 2 | 4.2E-5 | cm/cm/°C | |
| -- 3 | 1.8E-4 | cm/cm/°C |
| Optical | Nominal Value | Unit | |
|---|---|---|---|
| Refractive Index 4 | 1.569 | ||
| Transmittance | |||
| 550 nm | > 50.0 | % | |
| 700 to 1000 nm | > 98.0 | % | |
| 1100 to 1600 nm | > 95.0 | % |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Thermoset Components | |||
| Part A | Mix Ratio by Weight: 10 | ||
| Part B | Mix Ratio by Weight: 1.0 | ||
| Shelf Life (23°C) | 52 | wk |
| Uncured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Color | |||
| -- 5 | Amber | ||
| -- 6 | Clear/Transparent | ||
| Density | |||
| Part B | 1.02 | g/cm³ | |
| Part A | 1.20 | g/cm³ | |
| Viscosity 7(23°C) | 3.0 to 5.0 | Pa·s | |
| Curing Time (150°C) | 1.0 | hr | |
| Pot Life | 120 | min |
| Cured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Shore Hardness (Shore D) | 85 | ||
| Lap Shear Strength (23°C) | > 13.8 | MPa | |
| Relative Permittivity (1 kHz) | 3.17 | ||
| Volume Resistivity (23°C) | > 2.0E+13 | ohms·cm | |
| Dissipation Factor (1 kHz) | 5.0E-3 |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | 589 nm |
| 5 . | Part B |
| 6 . | Part A |
| 7 . | 50 rpm |
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