EPO-TEK® N20E

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Epoxy Technology Inc.
Trademark: EPO-TEK®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: FVdX40_EPO-TEK-N20E.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
Wechat: WECHAT
Message
EPO-TEK® N20E is a two component, electrically and thermally conductive, epoxy adhesive designed for semiconductor and electronics assembly. Its applications and field conditions include the optical, sensor, consumer, and industrial industries.
General Information
Features
  • Electrically Conductive
  • Electromagnetic Shielding (EMI)
  • Radio Frequency Shielding (RFI)
  • Thermally Conductive
  • Thixotropic
Uses
  • Adhesives
  • Consumer Applications
  • Electrical/Electronic Applications
  • Industrial Applications
  • Optical Applications
  • Printed Circuit Boards
Agency Ratings
  • EC 1907/2006 (REACH)
  • EU 2003/11/EC
  • EU 2006/122/EC
RoHS Compliance
  • RoHS Compliant
Forms
  • Paste
PhysicalNominal ValueUnit
Ion Type
    Cl- 34ppm
    K+ 10ppm
    Na+ 265ppm
    NH4+ 16ppm
Additional InformationNominal ValueUnitTest Method
Degradation Temperature 478°CTGA
Die Shear Strength - >10 kg (23°C) 23.4MPa
Operating Temperature
    Continuous -55 to 200°C
    Intermittent -55 to 300°C
Storage Modulus (23°C) 7.87GPa
Thixotropic Index 1.90
Weight Loss on Heating
    200°C 0.070%
    250°C 0.22%
    300°C 0.81%
ThermalNominal ValueUnit
Glass Transition Temperature 1> 70.0°C
CLTE - Flow
    -- 22.7E-5cm/cm/°C
    -- 38.9E-5cm/cm/°C
Thermal Conductivity 1.2W/m/K
ThermosetNominal ValueUnitTest Method
Thermoset Components
    Part A Mix Ratio by Weight: 1.0
    Part B Mix Ratio by Weight: 1.0
Shelf Life (23°C)52wk
Uncured PropertiesNominal ValueUnitTest Method
Color
    -- 4Grey
    -- 5Grey
Density
    Part B 2.85g/cm³
    Part A 2.92g/cm³
Viscosity 6(23°C)5.0 to 10Pa·s
Curing Time (150°C)1.0hr
Pot Life 2200min
Cured PropertiesNominal ValueUnitTest Method
Shore Hardness (Shore D)50
Volume Resistivity (23°C)< 0.070ohms·cm
Note Message
1 .Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min
2 .Below Tg
3 .Above Tg
4 .Part B
5 .Part A
6 .20 rpm
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