Celcon® MC270-HM

Category: Acetal (POM) Copolymer , Acetal (POM) Copolymer
Manufacturer: Celanese Corporation
Trademark: Celcon®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: F7g9OE_Celcon-MC270-HM.pdf
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Celcon® MC270-HM is a high modulus, mineral coupled acetal copolymer. It utilizes a higher additive level to provide significant improvement in product stiffness and mold shrinkage and better warpage resistance than unfilled Celcon® M270. Celcon® MC270-HM is formulated to produce very flat, dimensionally stable parts.
General Information
Filler / Reinforcement
  • Mineral filler
Features
  • Good dimensional stability
  • Low warpage
  • Rigidity, high
  • High liquidity
RoHS Compliance
  • Contact manufacturer
PhysicalNominal ValueUnitTest Method
Specific Gravity
    -- 1.60g/cm³ASTM D792
    -- 1.57g/cm³ISO 1183
Molding Shrinkage
    Flow 1.5%ASTM D955
    Transverse flow 1.2%ASTM D955
    Vertical flow direction 1.3%ISO 294-4
    Flow direction 1.5%ISO 294-4
Water Absorption ISO 62
    Saturated, 23°C 0.75%ISO 62
    Equilibrium, 23°C, 50% RH 0.20%ISO 62
MechanicalNominal ValueUnitTest Method
Tensile Modulus 3750MPaISO 527-2/1A/1
Tensile Strength
    Yield, 23°C 44.1MPaASTM D638
    Yield 45.0MPaISO 527-2/1A/50
Tensile Strain (Yield)5.0%ISO 527-2/1A/50
Flexural Modulus (23°C)3700MPaISO 178
Flexural Stress (23°C)77.0MPaISO 178
ImpactNominal ValueUnitTest Method
Charpy Notched Impact Strength ISO 179/1eA
    -30°C 3.5kJ/m²ISO 179/1eA
    23°C 4.8kJ/m²ISO 179/1eA
Notched Izod Impact (23°C)5.3kJ/m²ISO 180/1A
ThermalNominal ValueUnitTest Method
Deflection Temperature Under Load
    1.8 MPa, not annealed 97.2°CASTM D648
    1.8 MPa, not annealed 105°CISO 75-2/A
Melting Temperature 1165°CISO 11357-3, ASTM D3418
Linear thermal expansion coefficient ISO 11359-2
    Flow 6.0E-5cm/cm/°CISO 11359-2
    Lateral 9.0E-5cm/cm/°CISO 11359-2
InjectionNominal ValueUnit
Drying Temperature 80.0 - 100°C
Drying Time 3.0hr
Rear Temperature 170 - 180°C
Middle Temperature 180 - 190°C
Front Temperature 180 - 190°C
Nozzle Temperature 190 - 200°C
Processing (Melt) Temp 180 - 200°C
Mold Temperature 80.0 - 120°C
Injection Pressure 60.0 - 120MPa
Injection Rate Slow
Holding Pressure 60.0 - 120MPa
Back Pressure 0.00 - 0.500MPa
Injection instructions
Manifold Temperature: 190 to 200°CZone 4 Temperature: 190 to 200°C
Note Message
1 .10°C/min
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