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Sumikon® EME-7710

Category:	Epoxy , Epoxy; Epoxide
Manufacturer:	Sumitomo Bakelite Co., Ltd.
Trademark:	Sumikon®
Fillers:	-
Ports:	Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms	FOB, CIF, DAP, DAT, DDP
PDF:	F7MPle_Sumikon-EME-7710.pdf
PRICE:	Order Products email sales@su-jiao.com

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Sumikon 7700-Series compounds are multi-functional-type molding compounds developed for overmolded BGA packages.

General Information
Uses	Semiconductor molding compound
Forms	Liquid
Processing Method	Enclosure

Physical	Nominal Value	Unit	Test Method
Specific Gravity	1.89	g/cm³	ASTM D792
Water Absorption (24 hr)	0.40	%	ASTM D570

Mechanical	Nominal Value	Unit	Test Method
Flexural Modulus (25°C)	11300	MPa	ASTM D790
Flexural Strength (25°C)	93.2	MPa	ASTM D790

Thermal	Nominal Value	Unit	Test Method
Glass Transition Temperature	190	°C	ASTM E1356
Thermal Conductivity	0.75	W/m/K	ASTM C177

Electrical	Nominal Value	Unit	Test Method
Volume Resistivity	1.0E+13	ohms·cm	ASTM D257

Thermoset	Nominal Value	Unit
Demold Time (175°C)	1.5 - 2.0	min
Post Cure Time (175°C)	2.0 - 8.0	hr

Additional Information
Spiral Flow, SB-U-03-003: 75 cmGel Time, SB-U-03-005, 175°C: 32 secThermal Expansion, SB-U-02-002, TTg: 5.5 E-5/°CFlexural Strength, SB-U-01-001, 240°C: 20.6 MPaFlexural Modulus, SB-U-01-002, 240°C: 1373 MPaUL-94 Flame Class, SB-U-03-003: V-0Extracted Na+, SB-U-04-043: <1 ppmExtracted Cl-, SB-U-04-043: 5 ppmTransfer Pressure: 687-1177 MPa

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