EPO-TEK® ED1020

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Epoxy Technology Inc.
Trademark: EPO-TEK®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: EtqOnG_EPO-TEK-ED1020.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
Wechat: WECHAT
Message
A single component, silver-filled epoxy designed for low power semiconductor LED die attach applications. Its unique features include excellent adhesion and stress relief through mechanical reliability testing. Other attributes include long pot-life, low viscosity and high thixotropy making it ideal for a wide range of application methods including wafer level stamping and syringe dispensing.

Formerly 77-189
General Information
Filler / Reinforcement
  • Silver
Features
  • Good Adhesion
  • Low Viscosity
  • Thixotropic
Uses
  • Adhesives
  • Electrical/Electronic Applications
  • LEDs
Agency Ratings
  • EC 1907/2006 (REACH)
  • EU 2003/11/EC
  • EU 2006/122/EC
RoHS Compliance
  • RoHS Compliant
Forms
  • Paste
PhysicalNominal ValueUnit
Ion Type
    Cl- 169ppm
    K+ 4ppm
    Na+ 0ppm
    NH4+ 67ppm
Particle Size < 20.0µm
Additional InformationNominal ValueUnit
Degradation Temperature 333°C
Operating Temperature
    Continuous -55 to 150°C
    Intermittent -55 to 250°C
Storage Modulus (23°C) 249MPa
Thixotropic Index 3.00
Weight Loss on Heating
    200°C 0.68%
    250°C 1.2%
    300°C 1.7%
ThermalNominal ValueUnit
Glass Transition Temperature 1> 46.0°C
CLTE - Flow
    -- 24.5E-5cm/cm/°C
    -- 31.8E-4cm/cm/°C
Thermal Conductivity 1.9W/m/K
ThermosetNominal ValueUnit
Shelf Life (-40°C)52wk
Uncured PropertiesNominal ValueUnit
Color Silver
Density 2.88g/cm³
Viscosity
    23°C 41.5Pa·s
    23°C 59.6Pa·s
    23°C 629Pa·s
Curing Time (150°C)1.0hr
Pot Life 40000min
Cured PropertiesNominal ValueUnit
Shore Hardness (Shore D)40
Volume Resistivity (23°C)< 4.0E-4ohms·cm
Note Message
1 .Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min
2 .Below Tg
3 .Above Tg
4 .100 rpm
5 .10 rpm
6 .1 rpm
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