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DynaPath™ C2030CF
| Category: | Nylon 66 , Polyamide 66 |
| Manufacturer: | Polymer Dynamix |
| Trademark: | DynaPath™ |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | Eh0U0c_DynaPath-C2030CF.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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Features:
Applications:
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| General Information | |
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| Filler / Reinforcement |
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| Features |
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| Uses |
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| Physical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Specific Gravity | 1.22 | g/cm³ | ASTM D792 |
| Mechanical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Tensile Strength (Yield) | 241 | MPa | ASTM D638 |
| Tensile Elongation (Break) | 1.9 | % | ASTM D638 |
| Flexural Modulus | 20000 | MPa | ASTM D790 |
| Flexural Strength | 424 | MPa | ASTM D790 |
| Impact | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Notched Izod Impact (23°C, 3.18 mm) | 96 | J/m | ASTM D256 |
| Unnotched Izod Impact (23°C, 3.18 mm) | 1000 | J/m | ASTM D256 |
| Thermal | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Deflection Temperature Under Load (1.8 MPa, Unannealed, 3.20 mm) | 260 | °C | ASTM D648 |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| ABSCOM® F335 | Polymer Compounders Limited | ABS | ABSCOM® |
| Cytec MTF246 | Cytec Industries Inc. | Epoxy | Cytec |
| ElectriPlast® EP-SS/PC/ABS | Integral Technologies, Inc. | PC+ABS | ElectriPlast® |
| KOPA® KN333G25 | Kolon Plastics, Inc. | Nylon 66 | KOPA® |
| FUDOWLITE® F5760F | Fudow Co., Ltd. | Phenolic | FUDOWLITE® |
