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FM® 377
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Cytec Industries Inc. |
| Trademark: | FM® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | Ed6VeU_FM-377.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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FM® 377 film adhesive is a 350°F (177°C) cure modified epoxy designed for continuous services at 350°F (177°C). FM 377 film adhesive provides outstanding durability in bonding metallic and non-metallic substrates, and in the co-cure or secondary bonding of composites structures. FM 377 adhesive exhibits excellent structural performance from -67°F to 350°F (-55°C to 177°C). FM 377 adhesive is manufactured as a supported film with a knit carrier or as an unsupported film. The unsupported version can be easily reticulated on honeycomb core or perforated metal. Suggested Applications: Bonding metallic, non-metallic and sandwich structures Co-cure and secondary bonding of composite structures |
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| Additional Information | Nominal Value | Unit | |
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| Volatiles | < 1.0 | % |
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| RTP 200 TC-C-40 FR | RTP Company | Nylon 66 | RTP |
| Shinko-Lac® ASA S210 | Mitsubishi Rayon America Inc. | ASA | Shinko-Lac® |
| Chemlon® 509 | Teknor Apex Company (Chem Polymer) | Nylon 66 | Chemlon® |
| Huafon JF-D-C8903 | Huafon Group Co., Ltd. | PUR, Unspecified | Huafon |
| LEXAN™ 103 resin | SABIC Innovative Plastics | PC | LEXAN™ |
