"Dual Power" cleaning for a broad range of low-temp resins
DYNA-PURGE K is a low-temperature, non-abrasive, non-chemical engineered thermoplastic purging compound, formulated to flow naturally through the machine. Two unique ingredients provide for a "dual power" cleaning experience. A non-melting but softening thermoplastic scrubs while a proprietary additive expands, removing any contamination without leaving behind a residue.
FEATURES & BENEFITS:
- Developed for color changes, resin changes, preventative machine maintenance, and before manual cleaning
- Excellent for purging through equipment with a minimum clearance of 0.025 inch (0.65 mm) or greater
- Effective through a wide range of temperatures - 290°F to 550° F (143°C to 287°C)
- Easy to use - no process adjustment necessary - use at the resident resin processing temperature and RPM speed
- Non-abrasive, non-melting but softening thermoplastic, which thoroughly loosens carbonized and degraded resin, allowing it to be flushed out of the system
- Safe, non-hazardous, with no chemicals - ingredients are FDA compliant
- Heat stable - recommended during shutdown and start-up
- Low "cost-per-purge" - only a small quantity is needed to be effective
- No mixing required - simply use "as is"
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