Celcon® MC270

Category: Acetal (POM) Copolymer , Acetal (POM) Copolymer
Manufacturer: Celanese Corporation
Trademark: Celcon®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: CwcQOE_Celcon-MC270.pdf
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Celcon® MC270 is a mineral coupled acetal copolymer designed for applications requiring improved stiffness, lower mold shrinkage and reduced warpage while maintaining the mechanical performance characteristics of an unfilled Celcon® M270 grade.
General Information
Filler / Reinforcement
  • Mineral filler
Features
  • Low warpage
  • Rigid, good
  • High liquidity
  • Low shrinkage
RoHS Compliance
  • Contact manufacturer
Multi-Point Data
  • Isothermal Stress vs. Strain (ISO 11403-1)
PhysicalNominal ValueUnitTest Method
Specific Gravity 1.48g/cm³ASTM D792, ISO 1183
Molding Shrinkage
    Flow 1.9%ASTM D955
    Transverse flow 1.6%ASTM D955
    Vertical flow direction 1.6%ISO 294-4
    Flow direction 1.9%ISO 294-4
Water Absorption ISO 62
    Saturated, 23°C 0.75%ISO 62
    Equilibrium, 23°C, 50% RH 0.20%ISO 62
MechanicalNominal ValueUnitTest Method
Tensile Modulus 3150MPaISO 527-2/1A/1
Tensile Strength
    Yield, 23°C 53.1MPaASTM D638
    Yield 57.0MPaISO 527-2/1A/50
Tensile Strain (Yield)7.0%ISO 527-2/1A/50
Flexural Modulus (23°C)3100MPaISO 178
Flexural Stress (23°C)77.0MPaISO 178
ImpactNominal ValueUnitTest Method
Charpy Notched Impact Strength ISO 179/1eA
    -30°C 4.5kJ/m²ISO 179/1eA
    23°C 5.4kJ/m²ISO 179/1eA
Notched Izod Impact (23°C)5.5kJ/m²ISO 180/1A
ThermalNominal ValueUnitTest Method
Deflection Temperature Under Load
    1.8 MPa, not annealed 93.3°CASTM D648
    1.8 MPa, not annealed 101°CISO 75-2/A
Melting Temperature 1165°CISO 11357-3, ASTM D3418
Linear thermal expansion coefficient ISO 11359-2
    Flow 1.0E-4cm/cm/°CISO 11359-2
    Lateral 1.2E-4cm/cm/°CISO 11359-2
InjectionNominal ValueUnit
Drying Temperature 80.0 - 100°C
Drying Time 3.0hr
Rear Temperature 170 - 180°C
Middle Temperature 180 - 190°C
Front Temperature 180 - 190°C
Nozzle Temperature 190 - 200°C
Processing (Melt) Temp 180 - 200°C
Mold Temperature 80.0 - 120°C
Injection Pressure 60.0 - 120MPa
Injection Rate Slow
Holding Pressure 60.0 - 120MPa
Back Pressure 0.00 - 0.500MPa
Injection instructions
Manifold Temperature: 190 to 200°CZone 4 Temperature: 190 to 200°C
Note Message
1 .10°C/min
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