| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Cytec Industries Inc. |
| Trademark: | HTM® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | CuVsfd_HTM-60.pdf |
| PRICE: | Order Products email sales@su-jiao.com |
| Message |
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HTM® 60 is a 180°C (356°F) curing epoxy matrix resin developed for component manufacture where very high temperature resistance is required. After suitable post-cure, HTM60 offers a maximum Tg of 230°C (446°F) and retains a Tg of 155°C (311°F) under wet conditions. HTM60 will adhere to Nomex honeycomb without the need for an additional adhesive film. HTM60 is particularly suitable for high temperature structural and bodywork applications in the motorsport industry. |
| General Information | |
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| Features |
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| Uses |
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| Physical | Nominal Value | Unit | |
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| Specific Gravity 1 | 1.29 | g/cm³ |
| Note Message | |
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| 1 . | Cured resin |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| Ultradur® B 4040 G11 HMG BK15029 | BASF Corporation | PBT | Ultradur® |
| BIOLLOY KG340 | Techno Polymer Co, Ltd. | PLA+ABS | BIOLLOY |
| Edgetek™ ET3500-5001 | PolyOne Corporation | ASA+PC | Edgetek™ |
| Hylon® N1000TL | Ravago Manufacturing Americas, LLC | Nylon 66 | Hylon® |
| IDI SMC S90 (Glass Content 30%) | IDI Composites International | TS, Unspecified | IDI SMC |