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KumhoSunny PC 2203HI
| Category: | PC , Polycarbonate |
| Manufacturer: | Shanghai KumhoSunny Plastics Co., Ltd. |
| Trademark: | KumhoSunny PC |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | CpuYIF_KumhoSunny-PC-2203HI.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
Wechat:
| Message |
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| PC2203HI is high impact and super high flot PC resin. It has high tenacity in low temperature. PC2203HII is mainly used in mobile phone housing, etc. |
| General Information | |
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| Features |
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| Uses |
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| UL File Number |
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| Forms |
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| Processing Method |
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| Physical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Specific Gravity | 1.19 | g/cm³ | ASTM D792 |
| Melt Mass-Flow Rate (MFR) (300°C/1.2 kg) | 15 | g/10 min | ASTM D1238 |
| Molding Shrinkage - Flow | 0.50 to 0.70 | % | ASTM D955 |
| Mechanical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Tensile Strength | 65.0 | MPa | ASTM D638 |
| Tensile Elongation (Break) | 100 | % | ASTM D638 |
| Flexural Modulus | 2200 | MPa | ASTM D790 |
| Flexural Strength | 78.0 | MPa | ASTM D790 |
| Impact | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Notched Izod Impact (3.20 mm) | 800 | J/m | ASTM D256 |
| Thermal | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Deflection Temperature Under Load (1.8 MPa, Unannealed) | 125 | °C | ASTM D648 |
| Electrical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Surface Resistivity | > 1.0E+15 | ohms | IEC 60093 |
| Volume Resistivity | > 1.0E+15 | ohms·cm | IEC 60093 |
| Flammability | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Flame Rating (1.60 mm) | HB | UL 94 |
| Injection | Nominal Value | Unit | |
|---|---|---|---|
| Drying Temperature | 100 to 120 | °C | |
| Drying Time | 3.0 to 4.0 | hr | |
| Suggested Max Moisture | 0.020 | % | |
| Rear Temperature | 250 to 270 | °C | |
| Middle Temperature | 260 to 280 | °C | |
| Front Temperature | 280 to 300 | °C | |
| Nozzle Temperature | 280 to 290 | °C | |
| Processing (Melt) Temp | 265 to 310 | °C | |
| Mold Temperature | 60.0 to 100 | °C | |
| Back Pressure | 0.300 to 1.00 | MPa | |
| Screw Speed | 20 to 100 | rpm |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| Pyramid™ II230 | Polymics, Ltd. | PEI | Pyramid™ |
| Avalon 09 | Greene, Tweed & Co. | PTFE | Avalon |
| Chemiton CSF0RA 75 | Franplast S.r.l. | SEBS | Chemiton |
| Dynalloy™ OBC8000-T40 | PolyOne Corporation | TPE | Dynalloy™ |
| Lupoy® GN2201FM | LG Chem Ltd. | PC | Lupoy® |
