Category: | Epoxy , Epoxy; Epoxide |
Manufacturer: | Epoxy Technology Inc. |
Trademark: | EPO-TEK® |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | C4h2Eg_EPO-TEK-H70E-4.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
Message |
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EPO-TEK® H70E-4 is a two component, thermally conductive, electrically insulating epoxy adhesive for semiconductor, micro-electronic and opto-electronic packaging. It may be used for heat sinking power devices in the form of hybrid circuits or at the SMD / PCB level. |
General Information | |
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Features |
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Uses |
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Agency Ratings |
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RoHS Compliance |
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Forms |
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Physical | Nominal Value | Unit | |
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Particle Size | < 20.0 | µm |
Additional Information | Nominal Value | Unit | Test Method |
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Degradation Temperature | 432 | °C | TGA |
Die Shear Strength - >5 kg (23°C) | 11.7 | MPa | |
Operating Temperature | |||
Continuous | -55 to 200 | °C | |
Intermittent | -55 to 300 | °C | |
Storage Modulus (23°C) | 2.87 | GPa | |
Thixotropic Index | 3.20 | ||
Weight Loss on Heating | |||
200°C | 0.57 | % | |
250°C | 1.5 | % | |
300°C | 3.1 | % |
Thermal | Nominal Value | Unit | |
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Glass Transition Temperature 1 | > 80.0 | °C | |
CLTE - Flow | |||
-- 2 | 1.7E-5 | cm/cm/°C | |
-- 3 | 7.7E-5 | cm/cm/°C | |
Thermal Conductivity | 0.57 | W/m/K |
Thermoset | Nominal Value | Unit | Test Method |
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Thermoset Components | |||
Part A | Mix Ratio by Weight: 1.0 | ||
Part B | Mix Ratio by Weight: 1.0 | ||
Shelf Life (23°C) | 52 | wk |
Uncured Properties | Nominal Value | Unit | Test Method |
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Color | |||
-- 4 | Grey | ||
-- 5 | Grey | ||
Density | |||
Part A | 1.61 | g/cm³ | |
Part B | 2.01 | g/cm³ | |
Viscosity 6(23°C) | 20 to 40 | Pa·s | |
Curing Time (150°C) | 1.0 | hr | |
Pot Life | 3600 | min |
Cured Properties | Nominal Value | Unit | Test Method |
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Shore Hardness (Shore D) | 67 | ||
Lap Shear Strength (23°C) | 7.38 | MPa | |
Relative Permittivity (1 kHz) | 4.81 | ||
Volume Resistivity (23°C) | > 2.5E+13 | ohms·cm | |
Dissipation Factor (1 kHz) | 0.018 |
Note Message | |
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1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -40-200°C @ 20°C/Min |
2 . | Below Tg |
3 . | Above Tg |
4 . | Part B |
5 . | Part A |
6 . | 10 rpm |
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