Category: | Epoxy , Epoxy; Epoxide |
Manufacturer: | Epoxy Technology Inc. |
Trademark: | EPO-TEK® |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | C3n5Ch_EPO-TEK-H81A.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
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A two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging. |
General Information | |
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Filler / Reinforcement |
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Features |
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Uses |
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Agency Ratings |
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RoHS Compliance |
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Forms |
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Physical | Nominal Value | Unit | |
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Particle Size | < 50.0 | µm |
Additional Information | Nominal Value | Unit | |
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Degradation Temperature | 412 | °C | |
Die Shear Strength - >5 kg (23°C) | > 11.7 | MPa | |
Operating Temperature | |||
Continuous | -55 to 250 | °C | |
Intermittent | -55 to 350 | °C | |
Weight Loss on Heating | |||
200°C | < 0.050 | % | |
250°C | 0.070 | % | |
300°C | 0.16 | % |
Thermal | Nominal Value | Unit | |
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Glass Transition Temperature 1 | > 100 | °C |
Thermoset | Nominal Value | Unit | |
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Thermoset Components | |||
Part A | Mix Ratio by Weight: 6.0 | ||
Part B | Mix Ratio by Weight: 1.0 | ||
Shelf Life (23°C) | 52 | wk |
Uncured Properties | Nominal Value | Unit | |
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Color | |||
-- 2 | Brown | ||
-- 3 | Brown | ||
Density | |||
Part B | 5.61 | g/cm³ | |
Part A | 5.79 | g/cm³ | |
Viscosity 4(23°C) | 250 to 300 | Pa·s | |
Curing Time (150°C) | 1.0 | hr | |
Pot Life | 2900 | min |
Cured Properties | Nominal Value | Unit | |
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Volume Resistivity (23°C) | < 9.0E-4 | ohms·cm |
Note Message | |
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1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
2 . | Part B |
3 . | Part A |
4 . | 0.5 rpm |
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