EPO-TEK® H81A

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Epoxy Technology Inc.
Trademark: EPO-TEK®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: C3n5Ch_EPO-TEK-H81A.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
Wechat: WECHAT
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A two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.
General Information
Filler / Reinforcement
  • Gold
Features
  • Electrically Conductive
  • Thermally Conductive
Uses
  • Electrical/Electronic Applications
Agency Ratings
  • EC 1907/2006 (REACH)
  • EU 2003/11/EC
  • EU 2006/122/EC
RoHS Compliance
  • RoHS Compliant
Forms
  • Paste
PhysicalNominal ValueUnit
Particle Size < 50.0µm
Additional InformationNominal ValueUnit
Degradation Temperature 412°C
Die Shear Strength - >5 kg (23°C) > 11.7MPa
Operating Temperature
    Continuous -55 to 250°C
    Intermittent -55 to 350°C
Weight Loss on Heating
    200°C < 0.050%
    250°C 0.070%
    300°C 0.16%
ThermalNominal ValueUnit
Glass Transition Temperature 1> 100°C
ThermosetNominal ValueUnit
Thermoset Components
    Part A Mix Ratio by Weight: 6.0
    Part B Mix Ratio by Weight: 1.0
Shelf Life (23°C)52wk
Uncured PropertiesNominal ValueUnit
Color
    -- 2Brown
    -- 3Brown
Density
    Part B 5.61g/cm³
    Part A 5.79g/cm³
Viscosity 4(23°C)250 to 300Pa·s
Curing Time (150°C)1.0hr
Pot Life 2900min
Cured PropertiesNominal ValueUnit
Volume Resistivity (23°C)< 9.0E-4ohms·cm
Note Message
1 .Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min
2 .Part B
3 .Part A
4 .0.5 rpm
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