Category: | Epoxy , Epoxy; Epoxide |
Manufacturer: | Cytec Industries Inc. |
Trademark: | CYCOM® |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | BShSYi_CYCOM-985.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
Message |
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CYCOM® 985 is a 350°F (177°C) curing epoxy resin system. CYCOM 985 is designed for use where a balance of performance and processing characteristics is required. It has excellent structural performance and good impact resistance. CYCOM 985 is co-curable with structural adhesives and will produce outstanding thin-skinned sandwich structures. CYCOM 985 allows thick section construction without exotherm problems. Optimum properties are achieved by curing under autoclave pressure from 45 to 100 psi (as appropriate to panel configuration) at 350°F (177°C) for two hours. CYCOM 985 prepregs have good tack and drape and an out-time of two weeks at room temperature. |
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Physical | Nominal Value | Unit | |
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Specific Gravity 1 | 1.25 | g/cm³ |
Mechanical | Nominal Value | Unit | |
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Flexural Modulus 2 | 4070 | MPa | |
Flexural Strength 3 | 155 | MPa |
Note Message | |
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1 . | Neat Resin |
2 . | Neat Resin |
3 . | Neat Resin |
Resin Grade | Manufacturer | Category | Trademark |
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RTP 1505-55D | RTP Company | TEEE | RTP |
RTP 1000.75 FR A | RTP Company | PBT | RTP |
NYCOA Polyamide ASN 27/500 | Nycoa (Nylon Corporation of America) | Nylon 6 | NYCOA Polyamide |
KOPLA PA66 KDG1060F | KOPLA Co., Ltd. | Nylon 66 | KOPLA PA66 |
PHOENIX™ 11501 | Phon Tech Industrial Company | SBC | PHOENIX™ |