Order Products : sales@su-jiao.com

KYOCERA KE-G1250 LKDS

Category:	Epoxy , Epoxy; Epoxide
Manufacturer:	KYOCERA Chemical Corporation
Trademark:	KYOCERA
Fillers:	-
Ports:	Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms	FOB, CIF, DAP, DAT, DDP
PDF:	BSFiSV_KYOCERA-KE-G1250-LKDS.pdf
PRICE:	Order Products email sales@su-jiao.com

Wechat: WECHAT

WECHAT

Message

Special Epoxy Molding Compounds Optimizing Warpage and Applicable to Fine Pitch Wire for BGA Package

Strong Points

Less Warpage in All Types of Area Array Packages due to High Tg Characteristic.

Applicable to Fine Pitch Wire Bonding with Good Wire Sweep Performance.

Achieve High Yield after Molding due to Excellent Moldability that allows its application to MAP.

Application

Standard P-BGA, HS-BGA and LGA Package.

Multi Chip Module (Stacked or Side by Side Layout)

IC Card, Memory Card etc.

Low Alpha Ray Type: KE-G2250 LKDS

General Information
Features	Good Moldability
Uses	Electrical/Electronic Applications

Physical	Nominal Value	Unit
Specific Gravity	2.00	g/cm³
Spiral Flow	180	cm
Solution Viscosity	7000	mPa·s

Mechanical	Nominal Value	Unit
Flexural Modulus	25000	MPa
Flexural Strength	180	MPa

Thermal	Nominal Value	Unit
Glass Transition Temperature	130	°C
CLTE - Flow
-- ¹	8.0E-6	cm/cm/°C
-- ²	3.2E-5	cm/cm/°C

Note Message
1 .	Alpha 1
2 .	Alpha 2

Resin Grade	Manufacturer	Category	Trademark
RONFALIN® RXG03	A. Schulman Europe	ABS	RONFALIN®
Sarlink® TPE TPE EE-2265B-01 BLACK	Teknor Apex Company	TPE	Sarlink® TPE
TRANSMARE® 19HT40-0.001	Transmare Compounding B.V.	PP Homopolymer	TRANSMARE®
Durolon® I2700	Unigel Plásticos	PC	Durolon®
Ensinger HYDLAR® Z	Ensinger Inc.	Nylon 66	Ensinger