Plaskon AMC-2RA

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Cookson Electronics - Semiconductor Products
Trademark: Plaskon
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: BKTTOt_Plaskon-AMC-2RA.pdf
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This material is an epoxy molding compound specifically formulated for encapsulation of stress sensitive electronic devices including DIPs, SOICs, SSOPs and PLCCs. It can be used in conventional or automold applications. AMC-2RA is suitable for use with Ni/Pd preplated leadframes.
General Information
Features
  • Semi-conductive
  • Low viscosity
  • Fast curing
Uses
  • Electrical/Electronic Applications
  • Application in Automobile Field
Forms
  • Liquid
Processing Method
  • Resin transfer molding
PhysicalNominal ValueUnitTest Method
Specific Gravity 1.91g/cm³ASTM D792
Molding Shrinkage - Flow 0.20%ASTM D955
MechanicalNominal ValueUnitTest Method
Flexural Modulus 1.52MPaASTM D790
Flexural Strength 0.0132MPaASTM D790
ThermalNominal ValueUnitTest Method
Glass Transition Temperature 147°CASTM E1356
CLTE - Flow 1.4E-5cm/cm/°CASTM D696
ElectricalNominal ValueUnitTest Method
Volume Resistivity 1.0E+16ohms·cmASTM D257
Dielectric Strength 31kV/mmASTM D149
Dielectric Constant (1 kHz)3.55ASTM D150
Dissipation Factor (1 kHz)2.0E-3ASTM D150
Arc Resistance 180secASTM D495
FlammabilityNominal ValueUnitTest Method
Flame Rating (3.18 mm)V-0UL 94
Oxygen Index 32%ASTM D2863
Additional Information
Recommended Storage Temperature: 5°CLife @ 5°C, defined as not more than 40% loss of spiral flow based on original values.: 24 monthsLife @ 21°C, defined as not more than 40% loss of spiral flow based on original values.: 3 daysLife @ 35°C, defined as not more than 40% loss of spiral flow based on original values.: 2 daysSpiral Flow, 175°C, 1000 psi: 76 cmAutomatic Orifice Viscosity, 175°C, Shear Rate is 100000 sec-1, 1 mm die length, 1/2 mm diameter: 7 poiseRam Follower Gel Time, 175°C: 10 secAsh Content: 79 %Hydrolyzable Halides: <1 ppmCull Hot Hardness, Shore D, 90 sec, 175°C: 80Arc Resistance, 110v AC180 secAll test specimens are transfer molded and post cured for 4 hours at 175°C Linear Thermal Expansion, Alpha 1: 14 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 60 cm^-6/cm/°C The following information was transfer molded and post cured for 6 hours at 175°C Glass Transition Temperature Tg: 155°C Linear Thermal Expansion, Alpha 1: 12 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 61 cm^-6/cm/°C Thermal Conductivity0.0016 cal/cm-sec-°C
Injection instructions
Conventional Resin TransferMolding: Preheat Temperature: 85 to 95°C Molding Temperature: 165 to 175°C Molding Pressure: 500 to 1000 psi Cycle Time, 175°C: 60 to 90 sec Post Mold Cure Time, 175°C: 0 to 2 hr Gangpot Resin TransferMolding: Molding Temperature: 165 to 175°C Molding Pressure: 500 to 1000 psi Cycle Time, 175°C: <60 sec Post Mold Cure Time, 175°C: 0 to 2 hr
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