Category: | Epoxy , Epoxy; Epoxide |
Manufacturer: | Cookson Electronics - Semiconductor Products |
Trademark: | Plaskon |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | BKTTOt_Plaskon-AMC-2RA.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
Message |
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This material is an epoxy molding compound specifically formulated for encapsulation of stress sensitive electronic devices including DIPs, SOICs, SSOPs and PLCCs. It can be used in conventional or automold applications. AMC-2RA is suitable for use with Ni/Pd preplated leadframes. |
General Information | |
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Features |
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Uses |
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Processing Method |
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Physical | Nominal Value | Unit | Test Method |
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Specific Gravity | 1.91 | g/cm³ | ASTM D792 |
Molding Shrinkage - Flow | 0.20 | % | ASTM D955 |
Mechanical | Nominal Value | Unit | Test Method |
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Flexural Modulus | 1.52 | MPa | ASTM D790 |
Flexural Strength | 0.0132 | MPa | ASTM D790 |
Thermal | Nominal Value | Unit | Test Method |
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Glass Transition Temperature | 147 | °C | ASTM E1356 |
CLTE - Flow | 1.4E-5 | cm/cm/°C | ASTM D696 |
Electrical | Nominal Value | Unit | Test Method |
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Volume Resistivity | 1.0E+16 | ohms·cm | ASTM D257 |
Dielectric Strength | 31 | kV/mm | ASTM D149 |
Dielectric Constant (1 kHz) | 3.55 | ASTM D150 | |
Dissipation Factor (1 kHz) | 2.0E-3 | ASTM D150 | |
Arc Resistance | 180 | sec | ASTM D495 |
Flammability | Nominal Value | Unit | Test Method |
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Flame Rating (3.18 mm) | V-0 | UL 94 | |
Oxygen Index | 32 | % | ASTM D2863 |
Additional Information |
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Recommended Storage Temperature: 5°CLife @ 5°C, defined as not more than 40% loss of spiral flow based on original values.: 24 monthsLife @ 21°C, defined as not more than 40% loss of spiral flow based on original values.: 3 daysLife @ 35°C, defined as not more than 40% loss of spiral flow based on original values.: 2 daysSpiral Flow, 175°C, 1000 psi: 76 cmAutomatic Orifice Viscosity, 175°C, Shear Rate is 100000 sec-1, 1 mm die length, 1/2 mm diameter: 7 poiseRam Follower Gel Time, 175°C: 10 secAsh Content: 79 %Hydrolyzable Halides: <1 ppmCull Hot Hardness, Shore D, 90 sec, 175°C: 80Arc Resistance, 110v AC180 secAll test specimens are transfer molded and post cured for 4 hours at 175°C Linear Thermal Expansion, Alpha 1: 14 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 60 cm^-6/cm/°C The following information was transfer molded and post cured for 6 hours at 175°C Glass Transition Temperature Tg: 155°C Linear Thermal Expansion, Alpha 1: 12 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 61 cm^-6/cm/°C Thermal Conductivity0.0016 cal/cm-sec-°C |
Injection instructions |
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Conventional Resin TransferMolding: Preheat Temperature: 85 to 95°C Molding Temperature: 165 to 175°C Molding Pressure: 500 to 1000 psi Cycle Time, 175°C: 60 to 90 sec Post Mold Cure Time, 175°C: 0 to 2 hr Gangpot Resin TransferMolding: Molding Temperature: 165 to 175°C Molding Pressure: 500 to 1000 psi Cycle Time, 175°C: <60 sec Post Mold Cure Time, 175°C: 0 to 2 hr |
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