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EPO-TEK® EE165-3
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | Akvy4Y_EPO-TEK-EE165-3.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| A two component, silver-filled, electrically conductive epoxy made for bonding of SMDs, and general solder replacement at the PCB level and circuit assembly. It was designed to be low modulus and flexible in order to resist PCB drop testing. |
| General Information | |
|---|---|
| Filler / Reinforcement |
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| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Particle Size | < 20.0 | µm |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Degradation Temperature | 363 | °C | |
| Die Shear Strength - >5 kg (23°C) | 11.7 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 200 | °C | |
| Intermittent | -55 to 300 | °C | |
| Storage Modulus (23°C) | 1.38 | GPa | |
| Thixotropic Index | 4.80 | ||
| Weight Loss on Heating | |||
| 200°C | 0.26 | % | |
| 250°C | 0.56 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 20.0 | °C | |
| CLTE - Flow | |||
| -- 2 | 3.0E-5 | cm/cm/°C | |
| -- 3 | 2.1E-4 | cm/cm/°C | |
| Thermal Conductivity | 2.3 | W/m/K |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Thermoset Components | |||
| Part A | Mix Ratio by Weight: 100 | ||
| Part B | Mix Ratio by Weight: 2.5 | ||
| Shelf Life (23°C) | 52 | wk |
| Uncured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Color | |||
| -- 4 | Amber | ||
| -- 5 | Silver | ||
| Density | |||
| Part B | 1.06 | g/cm³ | |
| Part A | 4.02 | g/cm³ | |
| Viscosity 6(23°C) | 13 to 18 | Pa·s | |
| Curing Time (150°C) | 1.0 | hr | |
| Pot Life | 600 | min |
| Cured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Shore Hardness (Shore D) | 77 | ||
| Lap Shear Strength (23°C) | 9.60 | MPa | |
| Volume Resistivity (23°C) | < 2.0E-4 | ohms·cm |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | Part B |
| 5 . | Part A |
| 6 . | 20 rpm |
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