Plaskon AMC-2RC Datasheet,Epoxy,Cookson Electronics - Semiconductor Products-SHANGHAI SUSHENG

Message
This material is an epoxy molding compound specifically formulated for encapsulation of stress sensitive electronic devices including DIPs, SOICs, SSOPs and PLCCs. It can be used in conventional or automold applications.

General Information
Features	Semi-conductive Low viscosity Fast curing
Uses	Electrical/Electronic Applications Application in Automobile Field
Forms	Liquid
Processing Method	Resin transfer molding

Physical	Nominal Value	Unit	Test Method
Specific Gravity	1.91	g/cm³	ASTM D792

Mechanical	Nominal Value	Unit	Test Method
Flexural Modulus	1.66	MPa	ASTM D790
Flexural Strength	0.0132	MPa	ASTM D790

Thermal	Nominal Value	Unit	Test Method
Glass Transition Temperature	147	°C	ASTM E1356
CLTE - Flow	1.4E-5	cm/cm/°C	ASTM D696

Electrical	Nominal Value	Unit	Test Method
Volume Resistivity	1.0E+16	ohms·cm	ASTM D257
Dielectric Strength (1.50 mm)	31	kV/mm	ASTM D149
Dielectric Constant (1 kHz)	3.55		ASTM D150
Dissipation Factor (1 kHz)	2.0E-3		ASTM D150
Arc Resistance	180	sec	ASTM D495

Flammability	Nominal Value	Unit	Test Method
Flame Rating (3.18 mm)	V-0		UL 94
Oxygen Index	32	%	ASTM D2863

Additional Information
Recommended Storage Temperature: 5°CLife @ 5°C, defined as not more than 40% loss of spiral flow based on original values.: 24 monthsLife @ 21°C, defined as not more than 40% loss of spiral flow based on original values.: 3 daysLife @ 35°C, defined as not more than 40% loss of spiral flow based on original values.: 2 daysSpiral Flow, 175°C, 1000 psi: 76 cmAutomatic Orifice Viscosity, 175°C, Shear Rate is 100000 sec-1, 1 mm die length, 1/2 mm diameter: 70 poiseRam Follower Gel Time, 175°C: 10 secAsh Content: 79 %Hydrolyzable Halides: <1 ppmCull Hot Hardness, Shore D, 75 sec, 175°C: 72All test specimens are transfer molded and post cured for 4 hours at 175°C Linear Thermal Expansion, Alpha 1: 14 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 60 cm^-6/cm/°C The following information was transfer molded and post cured for 6 hours at 175°C Glass Transition Temperature Tg: 155°C Linear Thermal Expansion, Alpha 1: 12 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 61 cm^-6/cm/°C

Additional Information

Recommended Storage Temperature: 5°CLife @ 5°C, defined as not more than 40% loss of spiral flow based on original values.: 24 monthsLife @ 21°C, defined as not more than 40% loss of spiral flow based on original values.: 3 daysLife @ 35°C, defined as not more than 40% loss of spiral flow based on original values.: 2 daysSpiral Flow, 175°C, 1000 psi: 76 cmAutomatic Orifice Viscosity, 175°C, Shear Rate is 100000 sec-1, 1 mm die length, 1/2 mm diameter: 70 poiseRam Follower Gel Time, 175°C: 10 secAsh Content: 79 %Hydrolyzable Halides: <1 ppmCull Hot Hardness, Shore D, 75 sec, 175°C: 72All test specimens are transfer molded and post cured for 4 hours at 175°C Linear Thermal Expansion, Alpha 1: 14 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 60 cm^-6/cm/°C The following information was transfer molded and post cured for 6 hours at 175°C Glass Transition Temperature Tg: 155°C Linear Thermal Expansion, Alpha 1: 12 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 61 cm^-6/cm/°C

Injection instructions
Conventional Resin TransferMolding: Preheat Temperature: 85 to 95°C Molding Temperature: 175°C Molding Pressure: 56 to 98 kg/mm² Cycle Time: <90 sec Post Mold Cure Time, 175°C: 0 to 2 hr Transfer Time: 8 to 15sec Auto Resin TransferMolding: Transfer Time6 to 12 hr Cycle Time:30 to 60 sec Post Mold Cure Time, 175°C: 0 to 2 hr

Category:	Epoxy , Epoxy; Epoxide
Manufacturer:	Cookson Electronics - Semiconductor Products
Trademark:	Plaskon
Fillers:	-
Ports:	Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms	FOB, CIF, DAP, DAT, DDP
PDF:	AhFc3y_Plaskon-AMC-2RC.pdf
PRICE:	Order Products email sales@su-jiao.com

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