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EPO-TEK® H20F
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | A7IeD5_EPO-TEK-H20F.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| Message |
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| EPO-TEK® H20F is a two component, flexible silver epoxy. It was designed for flexible type circuitry, such as switching circuits in a flexible panel system, as well as large die-attach or substrate attach. |
| General Information | |
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| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Particle Size | < 45.0 | µm |
| Additional Information | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Degradation Temperature | 384 | °C | TGA |
| Die Shear Strength - >2 kg (23°C) | 4.69 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 175 | °C | |
| Intermittent | -55 to 275 | °C | |
| Storage Modulus (23°C) | 146 | MPa | |
| Thixotropic Index | 4.00 | ||
| Weight Loss on Heating | |||
| 200°C | 0.51 | % | |
| 250°C | 0.78 | % | |
| 300°C | 1.8 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 20.0 | °C | |
| CLTE - Flow 2 | 1.0E-5 | cm/cm/°C | |
| Thermal Conductivity | 4.1 | W/m/K |
| Thermoset | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Thermoset Components | |||
| Part A | Mix Ratio by Weight: 1.0 | ||
| Part B | Mix Ratio by Weight: 1.0 | ||
| Shelf Life (23°C) | 52 | wk |
| Uncured Properties | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Color | |||
| -- 3 | Silver | ||
| -- 4 | Silver | ||
| Density | |||
| Part A | 2.50 | g/cm³ | |
| Part B | 3.55 | g/cm³ | |
| Viscosity 5(23°C) | 1.5 to 3.0 | Pa·s | |
| Curing Time (150°C) | 1.0 | hr | |
| Pot Life | 2200 | min |
| Cured Properties | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Shore Hardness (Shore A) | 46 | ||
| Volume Resistivity (23°C) | < 1.0E-4 | ohms·cm |
| Note Message | |
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| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Part B |
| 4 . | Part A |
| 5 . | 100 rpm |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| Ultramid® B3EG10 | BASF Corporation | Nylon 6 | Ultramid® |
| COSMOPLENE® AS164 | TPC, The Polyolefin Company (Singapore) Pte Ltd | PP Copolymer | COSMOPLENE® |
| Geon™ Vinyl Flexible B65B1 | PolyOne Corporation | PVC, Flexible | Geon™ Vinyl Flexible |
| ENFLEX S3090A | ENPLAST Americas, a Ravago Group Company | TPE | ENFLEX |
| Polybutene-1 DP8911ME | LyondellBasell Industries | PB | Polybutene-1 |
