| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Sumitomo Bakelite Co., Ltd. |
| Trademark: | Sumikon® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | 9kLNIX_Sumikon-EME-7720TA.pdf |
| PRICE: | Order Products email sales@su-jiao.com |
| Message |
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| Sumikon 7700-Series compounds are multi-functional-type molding compounds developed for overmolded BGA packages. |
| General Information | |
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| Features |
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| Uses |
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| Forms |
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| Processing Method |
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| Physical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Specific Gravity | 2.00 | g/cm³ | ASTM D792 |
| Water Absorption (24 hr) | 0.33 | % | ASTM D570 |
| Mechanical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Flexural Modulus (25°C) | 20600 | MPa | ASTM D790 |
| Flexural Strength (25°C) | 177 | MPa | ASTM D790 |
| Thermal | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Glass Transition Temperature | 195 | °C | ASTM E1356 |
| Thermal Conductivity | 0.79 | W/m/K | ASTM C177 |
| Electrical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Volume Resistivity | 1.0E+13 | ohms·cm | ASTM D257 |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Demold Time (175°C) | 0.50 - 1.7 | min | |
| Post Cure Time (175°C) | 2.0 - 8.0 | hr |
| Additional Information |
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| Spiral Flow, SB-U-03-003: 130 cmGel Time, SB-U-03-005, 175°C: 27 secThermal Expansion, SB-U-02-002, T |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| Quadrathane™ ALC-93A-B20 | Biomerics, LLC | TPU-PC | Quadrathane™ |
| Mowiol® 47-88 | Kuraray Co., Ltd. | PVOH | Mowiol® |
| Bergamid™ X2 B70 U NC | PolyOne Corporation | Nylon 6 | Bergamid™ |
| Cellophane™ CelloPlus™ W (White) | Innovia Films Ltd. | Cellulose, Regenerated | Cellophane™ |
| Elastollan® S 98 A | BASF Polyurethanes GmbH | TPU-Polyester | Elastollan® |