Silamid® HSV30

Category: Nylon 6 , Polyamide 6
Manufacturer: Roonamid a.s.
Trademark: Silamid®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: 9U1gVa_Silamid-HSV30.pdf
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Polyamide 6, type reinforced with 30% short glass fibres, optimal flow properties, black, increased termo-oxidation stability. Suitable for injection mouldings with increased requirements to rigidity, strength, shape stability and in cases, where increased thermal stress occurs.
General Information
Filler / Reinforcement
  • Glass Fiber, 30% Filler by Weight
Features
  • Good Dimensional Stability
  • Good Flow
  • Good Strength
  • Good Thermal Stability
  • High Rigidity
Appearance
  • Black
Forms
  • Pellets
Processing Method
  • Injection Molding
PhysicalDryConditionedUnitTest Method
Density 1.361.36g/cm³ISO 1183
Melt Mass-Flow Rate (MFR) (230°C/2.16 kg)3.03.0g/10 minISO 1133
Molding Shrinkage
     Across Flow 1.31.3%
     Flow 0.500.50%
Water Absorption (23°C, 24 hr)0.900.90%ISO 62
MechanicalDryConditionedUnitTest Method
Tensile Modulus 90006000MPaISO 527-2
Tensile Stress (Break)160105MPaISO 527-2
Flexural Modulus 70004500MPaISO 178
ImpactDryConditionedUnitTest Method
Charpy Notched Impact Strength (23°C)1015kJ/m²ISO 179/1eA
Charpy Unnotched Impact Strength (23°C)5060kJ/m²ISO 179/1eU
ThermalDryConditionedUnitTest Method
Heat Deflection Temperature
     0.45 MPa, Unannealed 210--°CISO 75-2/B
     1.8 MPa, Unannealed 200--°CISO 75-2/A
ElectricalDryConditionedUnitTest Method
Surface Resistivity --1.0E+12ohmsIEC 60093
Volume Resistivity --1.0E+11ohms·cmIEC 60093
Electric Strength --20kV/mmIEC 60243-1
Relative Permittivity (1 MHz)--4.70IEC 60250
Dissipation Factor (1 MHz)--0.12IEC 60250
Arc Resistance 105--secASTM D495
Comparative Tracking Index (Solution A)--500VIEC 60112
FlammabilityDryConditionedUnitTest Method
Flame Rating HB--UL 94
Glow Wire Ignition Temperature 1650650°CIEC 60695-2-13
Additional InformationDryConditionedTest Method
Thermal Resistance 2130--ISO 75-2
InjectionDryUnit
Drying Temperature < 80.0°C
Suggested Max Moisture 0.10%
Processing (Melt) Temp 250 to 280°C
Mold Temperature 60.0 to 80.0°C
Note Message
1 .Range: 850 to 960°C
2 .decrease 0%/1000h
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