Category: | Epoxy , Epoxy; Epoxide |
Manufacturer: | Henkel Ablestik |
Trademark: | Ablefilm |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | 9GosRZ_Ablefilm-ECF550.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
Message |
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Ablefilm® ECF550 silver filled, epoxy adhesive film is designed for microelectronic applications which require electrical conductivity. When used for substrate attach, ECF550 adhesive film acts as an electrical ground plane. In the assembly or sealing of microelectronic packages which require RF shielding, ECF550 adhesive film maintains electrical continuity between joints. Ablefilm ECF550 adhesive film provides strong adhesion to gold and other difficult-to-bond metals. After exposure to moisture, it retains its bond strength. This adhesive film is also available in a low temperature cure version. |
General Information | |
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Filler / Reinforcement |
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Features |
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Uses |
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Appearance |
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Forms |
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Thermal | Nominal Value | Unit | Test Method |
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Glass Transition Temperature | 81.0 | °C | Internal Method |
CLTE - Flow | Internal Method | ||
> 81°C | 4.6E-5 | cm/cm/°C | |
< 81°C | 6.6E-5 | cm/cm/°C | |
Thermal Conductivity (121°C) | 1.0 | W/m/K | Internal Method |
Electrical | Nominal Value | Unit | Test Method |
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Electrical Resistivity 1 | 0.00200 | ohms/in² | Internal Method |
Additional Information | Nominal Value | Unit | Test Method |
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Carrier Resin | Glass Fabric | ||
Lap Shear | Internal Method | ||
Al to Al : 25°C | 20.7 | MPa | |
Au to Au : 25°C | 24.1 | MPa | |
Work Life (25°C) | 6.0 | month | Internal Method |
Thermoset | Nominal Value | Unit | Test Method |
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Shelf Life | |||
-40°C | 52 | wk | |
5°C | 39 | wk | |
25°C | 26 | wk | |
Post Cure Time | |||
125°C | 2.0 | hr | |
150°C | 0.50 | hr |
Note Message | |
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1 . | Measured through Gold Joints |
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