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EPO-TEK® H20E-SLR
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | 8lgTIH_EPO-TEK-H20E-SLR.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| Message |
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| EPO-TEK® H20E-SLR is a two-component, electrically conductive, epoxy adhesive designed for solar ribbon bonding of photovoltaic modules. It provides the electrical back-contact for ribbon stringing of solar cells into modules and panels. |
| General Information | |
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| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Particle Size | < 20.0 | µm |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Degradation Temperature | 388 | °C | |
| Die Shear Strength - >10 kg (23°C) | 23.4 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 200 | °C | |
| Intermittent | -55 to 300 | °C | |
| Storage Modulus | 7.18 | GPa | |
| Thixotropic Index | 3.30 | ||
| Weight Loss on Heating | |||
| 200°C | 0.61 | % | |
| 250°C | 2.0 | % | |
| 300°C | 3.5 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | 81.0 | °C | |
| CLTE - Flow | |||
| -- 2 | 4.8E-5 | cm/cm/°C | |
| -- 3 | 2.3E-4 | cm/cm/°C | |
| Thermal Conductivity | 1.2 | W/m/K |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Thermoset Components | |||
| Part A | Mix Ratio by Weight: 10 | ||
| Part B | Mix Ratio by Weight: 8.0 | ||
| Shelf Life (23°C) | 52 | wk |
| Uncured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Color | |||
| -- 4 | Silver | ||
| -- 5 | Silver | ||
| Density | |||
| Part A | 1.96 | g/cm³ | |
| Part B | 2.43 | g/cm³ | |
| Viscosity 6(23°C) | 4.4 | Pa·s | |
| Curing Time (140°C) | 0.17 | hr | |
| Pot Life | 1200 | min |
| Cured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Shore Hardness (Shore D) | 53 | ||
| Lap Shear Strength (23°C) | 7.17 | MPa | |
| Volume Resistivity (23°C) | < 4.0E-3 | ohms·cm |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | Part B |
| 5 . | Part A |
| 6 . | 50 rpm |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| Tarnamid® T- 27 GF10 FR850 | Grupa Azoty S.A. | Nylon 6 | Tarnamid® |
| XANTAR® G4F 23 R | Mitsubishi Engineering-Plastics Corp | PC | XANTAR® |
| Daelim Po1y® PH-630 | DAELIM INDUSTRIAL CO., LTD. | PP Homopolymer | Daelim Po1y® |
| Hostacom TRC 452N NAT | LyondellBasell Industries | Polyolefin, Unspecified | Hostacom |
| HyTemp® 4052 | Zeon Chemicals L.P. | Acrylic, Unspecified | HyTemp® |
