Category: | Polyolefin, Unspecified , Polyolefin Adhesive Film |
Manufacturer: | The Dow Chemical Company |
Trademark: | INTEGRAL™ |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | 7ZISMh_INTEGRAL-E100.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
Message |
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INTEGRAL™ E100 Film is a versatile, heat-activated film which bonds to a variety of substrates including: metals (e.g., aluminum, galvanized steel, copper, brass, magnesium), fibers (e.g., paper, cotton, glass, nonwovens, mineral wool), and plastics (e.g., polyethylene, nylon, polyester, polyurethane foams/sheet, acrylic adhesives). INTEGRAL E100 can also be used as a tie layer to provide bond between substrates. Corona treatment is available. New experimental films are continually being developed. Please discuss your particular application needs with your Dow representative. General Characteristics:
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General Information | |
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Appearance |
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Forms |
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Films | Nominal Value | Unit | Test Method |
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Film Thickness - Tested | 51 | µm | |
Film Thickness - Recommended / Available | 1.0-6.0 mil (25-150 µ) | ||
Secant Modulus | ASTM D882 | ||
2% Secant, MD : 51 µm | 138 | MPa | |
2% Secant, TD : 51 µm | 131 | MPa | |
Tensile Strength | ASTM D882 | ||
MD : Break, 51 µm | 24.8 | MPa | |
TD : Break, 51 µm | 22.8 | MPa | |
Tensile Elongation | ASTM D882 | ||
MD : Break, 51 µm | 320 | % | |
TD : Break, 51 µm | 490 | % | |
Film Width | 30.48 to 243.84 | cm | |
Heat Seal Strength 1(149°C) | 560 | N/m | Internal Method |
Yield (25.4 µm) | 42.2 | m²/kg |
Thermal | Nominal Value | Unit | |
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Heat Activation Temperature | 102 | °C |
Note Message | |
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1 . | 40 psi, 0.5 sec dwell, due to substrate failure |
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