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AIE PC/ABS A2200FR-3070
| Category: | PC+ABS , Polycarbonate + ABS |
| Manufacturer: | Asia International Enterprise (Hong Kong) Limited |
| Trademark: | AIE PC/ABS |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | 7PeuuK_AIE-PC-ABS-A2200FR-3070.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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AIE PC/ABS A2200FR-3070 is a Polycarbonate + ABS (PC+ABS) material. It is available in Africa & Middle East, Asia Pacific, Europe, Latin America, or North America for injection molding. Important attributes of AIE PC/ABS A2200FR-3070 are:
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| General Information | |
|---|---|
| Features |
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| RoHS Compliance |
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| Forms |
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| Processing Method |
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| Physical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Density | 1.14 | g/cm³ | ISO 1183 |
| Melt Mass-Flow Rate (MFR) (300°C/1.2 kg) | 12 | g/10 min | ISO 1133 |
| Molding Shrinkage | 0.50 to 0.80 | % | Internal Method |
| Water Absorption (23°C, 24 hr) | 0.30 | % | ISO 62 |
| Mechanical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Tensile Stress (Yield) | 56.0 | MPa | ISO 527-2 |
| Tensile Strain (Break) | 63 | % | ISO 527-2 |
| Flexural Modulus | 2000 | MPa | ISO 178 |
| Flexural Stress | 82.0 | MPa | ISO 178 |
| Impact | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Notched Izod Impact Strength (23°C) | 46 | kJ/m² | ISO 180 |
| Thermal | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Heat Deflection Temperature | |||
| 0.45 MPa, Unannealed | 100 | °C | ISO 75-2/B |
| 1.8 MPa, Unannealed | 88.0 | °C | ISO 75-2/A |
| Flammability | Nominal Value | Test Method | |
|---|---|---|---|
| Flame Rating (1.50 mm) | V-0 | UL 94 |
| Injection | Nominal Value | Unit | |
|---|---|---|---|
| Drying Temperature | 90.0 to 100 | °C | |
| Drying Time | 3.0 to 4.0 | hr | |
| Processing (Melt) Temp | 220 to 260 | °C | |
| Mold Temperature | 80.0 to 110 | °C | |
| Injection Pressure | 40.0 to 100 | MPa |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| POWERSIL® GEL C 670 A/B | Wacker Chemie AG | Silicone | POWERSIL® |
| TRIREX® 3017PJ | Samyang Corporation | PC | TRIREX® |
| Borlink™ LE0500EHV | Borealis AG | PE, Unspecified | Borlink™ |
| Hostacom BR 33 G | LyondellBasell Industries | PP, Unspecified | Hostacom |
| Lucky Enpla LAY1000 9309 | Lucky Enpla Co LTD | PC+ABS | Lucky Enpla |
