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NuSil CF2-2186

Category:	Silicone , Silicone
Manufacturer:	NuSil Technology
Trademark:	NuSil
Fillers:	-
Ports:	Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms	FOB, CIF, DAP, DAT, DDP
PDF:	71EpLT_NuSil-CF2-2186.pdf
PRICE:	Order Products email sales@su-jiao.com

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Message
As a low stress alternative for electronic packaging, NuSil Technology's silicones allow the designer to choose from a unique line of silicones for various levels of packaging. We have an extensive line of encapsulants, adhesives, and greases to choose from. These include thermally and electrically conductive silicones for Thermal Interface Materials (TIM) or for EMI and RFI shielding applications. Benefits of Silicone for Electronics: Wide Operating Temperature Range of -115 °C to 250 °C Low moisture absorption, < 0.4% Typical Corrosion Resistance High Dielectric Strength > 500 V/mil (0.001 inch) or 20 kV/mm Fillers can be added to provide thermal and electrical conductive properties Low Modulus (Typically less than 5.5 MPa/800 psi) Stable chemical and mechanical properties when exposed to high temperatures Low Shrinkage Available as gels, elastomers, film adhesives sheeting, and greases General Purpose: Potting and Encapsulating Materials Comments: Medium Viscosity, All Purpose Potting & Encapsulant

Message

As a low stress alternative for electronic packaging, NuSil Technology's silicones allow the designer to choose from a unique line of silicones for various levels of packaging. We have an extensive line of encapsulants, adhesives, and greases to choose from. These include thermally and electrically conductive silicones for Thermal Interface Materials (TIM) or for EMI and RFI shielding applications.

Benefits of Silicone for Electronics:

Wide Operating Temperature Range of -115 °C to 250 °C

Low moisture absorption, < 0.4% Typical

Corrosion Resistance

High Dielectric Strength > 500 V/mil (0.001 inch) or 20 kV/mm

Fillers can be added to provide thermal and electrical conductive properties

Low Modulus (Typically less than 5.5 MPa/800 psi)

Stable chemical and mechanical properties when exposed to high temperatures

Low Shrinkage

Available as gels, elastomers, film adhesives sheeting, and greases

General Purpose: Potting and Encapsulating Materials

Comments: Medium Viscosity, All Purpose Potting & Encapsulant

General Information
Features	Good Corrosion Resistance Good Thermal Stability Low Moisture Absorption Low Shrinkage Medium Viscosity
Uses	Electrical/Electronic Applications
Processing Method	Encapsulating Potting

Thermoset	Nominal Value	Unit
Thermoset Components
Part A	Mix Ratio by Weight: 10
Part B	Mix Ratio by Weight: 1.0

Additional Information	Nominal Value	Unit
Cure System	Platinum
Operating Temperature	-65 to 240	°C

Uncured Properties	Nominal Value	Unit
Color	Translucent
Density	1.10	g/cm³
Viscosity
-- ¹	18	Pa·s
-- ²	38	Pa·s
Curing Time (150°C)	0.17	hr
Pot Life	120	min

Cured Properties	Nominal Value	Unit
Shore Hardness (Shore A)	20
Tensile Strength	6.21	MPa
Tensile Elongation at Break	600	%
Tear Strength	12.3	kN/m
Electric Strength	20	kV/mm

Note Message
1 .	Part B
2 .	Part A

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