Plaskon ALP-2 (188) Datasheet,Epoxy,Cookson Electronics - Semiconductor Products-SHANGHAI SUSHENG

Message
This material is an epoxy encapsulant for high productivity packaging of very thin, stress-sensitive devices such as TSSOP's. Performance attributes are intended to meet or exceed JEDEC Level 1 for all packages and have no or limited post-mold cure, fast cure cycle times tailored to specific applications and excellent adhesion to Cu and Pd-Ni leadframes.

General Information
Features	Semi-conductive Low hygroscopicity Laser marking Fast molding cycle Fast curing Good formability
Uses	Thin wall packaging
Forms	Liquid
Processing Method	Resin transfer molding

Physical	Nominal Value	Unit	Test Method
Specific Gravity	1.92	g/cm³	ASTM D792

Mechanical	Nominal Value	Unit	Test Method
Flexural Modulus			ASTM D790
22°C	2.26	MPa	ASTM D790
260°C	0.0735	MPa	ASTM D790
Flexural Strength			ASTM D790
22°C	0.0127	MPa	ASTM D790
260°C	6.86E-4	MPa	ASTM D790

Thermal	Nominal Value	Unit	Test Method
Glass Transition Temperature	111	°C	ASTM E1356
CLTE - Flow	9.0E-6	cm/cm/°C	ASTM D696
Thermal Conductivity	1.0	W/m/K	ASTM C177

Electrical	Nominal Value	Unit	Test Method
Volume Resistivity	1.0E+12	ohms·cm	ASTM D257
Dielectric Strength	55	kV/mm	ASTM D149
Dielectric Constant (1 MHz)	3.80		ASTM D150

Flammability	Nominal Value	Unit	Test Method
Flame Rating (3.18 mm)	V-0		UL 94

Additional Information
Recommended Storage Temperature: <5°CLife @ 5°C, defined as not more than 40% loss of spiral flow based on original values.: 6 monthsLife @ 22°C, defined as not more than 40% loss of spiral flow based on original values.: 2 daysLife @ 35°C, defined as not more than 40% loss of spiral flow based on original values.: 0.5 daysSpiral Flow, 175°C, 1000 psi: 100 cmShimadzu Viscosity, 175°C, 1000 psi: 50 poiseRam Follower Gel Time, 175°C, 1000 psi: 16 secAsh Content: 86 %Hydrolyzable Halides: <1 ppmMoisture Absorption, 85°C/85%RH, 168 hrs: 0.25%Cull Hot Hardness, Shore D: 70Volume Resistivity, 22°C: 1e12 ohm-cmVolume Resistivity, 150°C: 1e9 ohm-cmAll test specimens are transfer molded and post cured for 4 hours at 175°C Linear Thermal Expansion, Alpha 1: 9 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 39 cm^-6/cm/°C

Additional Information

Recommended Storage Temperature: <5°CLife @ 5°C, defined as not more than 40% loss of spiral flow based on original values.: 6 monthsLife @ 22°C, defined as not more than 40% loss of spiral flow based on original values.: 2 daysLife @ 35°C, defined as not more than 40% loss of spiral flow based on original values.: 0.5 daysSpiral Flow, 175°C, 1000 psi: 100 cmShimadzu Viscosity, 175°C, 1000 psi: 50 poiseRam Follower Gel Time, 175°C, 1000 psi: 16 secAsh Content: 86 %Hydrolyzable Halides: <1 ppmMoisture Absorption, 85°C/85%RH, 168 hrs: 0.25%Cull Hot Hardness, Shore D: 70Volume Resistivity, 22°C: 1e12 ohm-cmVolume Resistivity, 150°C: 1e9 ohm-cmAll test specimens are transfer molded and post cured for 4 hours at 175°C Linear Thermal Expansion, Alpha 1: 9 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 39 cm^-6/cm/°C

Injection instructions
Resin Transfer Molding: Molding Temperature: 170 to 185°C Molding Pressure: 750 to 1250 psi In Mold Cure Time: 70 to 120 sec Post Mold Cure Time, 175°C: 0 to 4 hr

Category:	Epoxy , Epoxy; Epoxide
Manufacturer:	Cookson Electronics - Semiconductor Products
Trademark:	Plaskon
Fillers:	-
Ports:	Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms	FOB, CIF, DAP, DAT, DDP
PDF:	6xYBBl_Plaskon-ALP-2-188-.pdf
PRICE:	Order Products email sales@su-jiao.com

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