Vyncolit® EM7302

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Vyncolit N.V.
Trademark: Vyncolit®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: 6LZeYo_Vyncolit-EM7302.pdf
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EM 7302 is a long fiberglass reinforced epoxy molding compound, which features high strength and toughness for structural components. This compound is designed for applications requiring MIL-M-46069 certification.
General Information
Filler / Reinforcement
  • Long glass fiber
Features
  • The degassing effect is low to no
  • Low viscosity
  • Solvent resistance
  • Anti-salt water/fog
  • Good thermal shock resistance
  • Good chemical resistance
  • alkali resistance
  • acid resistance
  • Non-corrosive
Uses
  • Electrical components
  • Military application
  • Connector
Agency Ratings
  • FDA not rated
  • MIL MIL
  • USDA Unspecified Approval
Appearance
  • Black
  • Natural color
Forms
  • Particles
Processing Method
  • Resin transfer molding
  • Compression molding
PhysicalNominal ValueUnitTest Method
Specific Gravity 1.85g/cm³ASTM D792
Molding Shrinkage - Flow (Compression Molded)0.10%ASTM D955
HardnessNominal ValueUnitTest Method
Rockwell Hardness (M-Scale)105ASTM D785
MechanicalNominal ValueUnitTest Method
Tensile Strength (Break, Compression Molded)138MPaASTM D638
Flexural Modulus (Compression Molded)24000MPaASTM D790
Flexural Strength (Break)345MPaASTM D790
Compressive Strength 255MPaASTM D695
ImpactNominal ValueUnitTest Method
Notched Izod Impact (Compression Molded)1600J/mASTM D256
ThermalNominal ValueUnitTest Method
Deflection Temperature Under Load (1.8 MPa, Unannealed, Compression Molded)250°CASTM D648
CLTE - Flow 1.2E-5cm/cm/°CASTM E831
Thermal Conductivity 0.42W/m/KASTM C177
ElectricalNominal ValueUnitTest Method
Dielectric Strength 113kV/mmASTM D149
Dielectric Constant (1 MHz)5.80ASTM D150
Dissipation Factor (1 MHz)0.017ASTM D150
Arc Resistance 120secASTM D495
Injection instructions
Gauge: 0.3The value listed as Thermal Conductivity, ASTM C177, was tested in accordance with ASTM C518.Water Absorption, ASTM D570, 48 hrs, 50°C: 0.15%DTUL @264psi - Unannealed, ASTM D648, Post Baked, Compression Molded: 250°CDielectric Strength, ASTM D149, 60 Hz, Method B, wet: 12.8 kV/mmDielectric Constant, ASTM D150, 1000000 Hz, dry: 5.8Dissipation Factor, ASTM D150, 1000000 Hz, dry: 0.017Compression and Transfer Molding Conditions: Preheat Temperature: 200 to 225 °F Mold Temperature: 270 to 330 °F Compression Mold Pressure: 1000 to 8000 psi Transfer Mold Pressure: 2500 to 8000 psi Cure Time, 0.125 in: 150 to 300 sec
Note Message
1 .Method B (step by step)
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